Grain refinement in copper via cryogenic deformation

T. N. Konkova, S. Yu Mironov, A. V. Korznikov

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The high-resolution electron backscatter diffraction (EBSD) was employed to study microstructure produced by cryogenic high-pressure torsion of copper. The long term (∼11 months) thermal stability of the obtained material at room temperature was also evaluated. It has been established that severe cryogenic deformation leads to a considerable grain refinement down to 0.3 μm. However the obtained material was shown to be quite unstable exhibiting abnormal grain growth at ambient temperature.

LanguageEnglish
Pages31-35
Number of pages5
JournalReviews on Advanced Materials Science
Volume31
Issue number1
Publication statusPublished - 2012

Fingerprint

Grain refinement
Cryogenics
cryogenics
Copper
copper
Grain growth
Electron diffraction
Torsional stress
ambient temperature
torsion
Thermodynamic stability
thermal stability
Temperature
microstructure
Microstructure
high resolution
room temperature
diffraction
electrons

Keywords

  • Grain refinement
  • copper
  • electron backscatter diffraction
  • cryogenic deformation
  • cryogenic high-pressure torsion

Cite this

Konkova, T. N. ; Mironov, S. Yu ; Korznikov, A. V. / Grain refinement in copper via cryogenic deformation. In: Reviews on Advanced Materials Science. 2012 ; Vol. 31, No. 1. pp. 31-35.
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Konkova, TN, Mironov, SY & Korznikov, AV 2012, 'Grain refinement in copper via cryogenic deformation' Reviews on Advanced Materials Science, vol. 31, no. 1, pp. 31-35.

Grain refinement in copper via cryogenic deformation. / Konkova, T. N.; Mironov, S. Yu; Korznikov, A. V.

In: Reviews on Advanced Materials Science, Vol. 31, No. 1, 2012, p. 31-35.

Research output: Contribution to journalArticle

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AU - Mironov, S. Yu

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