Grain refinement in copper via cryogenic deformation

T. N. Konkova; S. Yu Mironov; A. V. Korznikov

Grain refinement in copper via cryogenic deformation

T. N. Konkova, S. Yu Mironov, A. V. Korznikov

Design, Manufacturing And Engineering Management

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

The high-resolution electron backscatter diffraction (EBSD) was employed to study microstructure produced by cryogenic high-pressure torsion of copper. The long term (∼11 months) thermal stability of the obtained material at room temperature was also evaluated. It has been established that severe cryogenic deformation leads to a considerable grain refinement down to 0.3 μm. However the obtained material was shown to be quite unstable exhibiting abnormal grain growth at ambient temperature.

Original language	English
Pages (from-to)	31-35
Number of pages	5
Journal	Reviews on Advanced Materials Science
Volume	31
Issue number	1
Publication status	Published - 2012

Keywords

Grain refinement
copper
electron backscatter diffraction
cryogenic deformation
cryogenic high-pressure torsion

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title = "Grain refinement in copper via cryogenic deformation",

abstract = "The high-resolution electron backscatter diffraction (EBSD) was employed to study microstructure produced by cryogenic high-pressure torsion of copper. The long term (∼11 months) thermal stability of the obtained material at room temperature was also evaluated. It has been established that severe cryogenic deformation leads to a considerable grain refinement down to 0.3 μm. However the obtained material was shown to be quite unstable exhibiting abnormal grain growth at ambient temperature. ",

keywords = "Grain refinement, copper, electron backscatter diffraction, cryogenic deformation, cryogenic high-pressure torsion",

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AU - Mironov, S. Yu

AU - Korznikov, A. V.

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AB - The high-resolution electron backscatter diffraction (EBSD) was employed to study microstructure produced by cryogenic high-pressure torsion of copper. The long term (∼11 months) thermal stability of the obtained material at room temperature was also evaluated. It has been established that severe cryogenic deformation leads to a considerable grain refinement down to 0.3 μm. However the obtained material was shown to be quite unstable exhibiting abnormal grain growth at ambient temperature.

KW - Grain refinement

KW - copper

KW - electron backscatter diffraction

KW - cryogenic deformation

KW - cryogenic high-pressure torsion

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