TY - JOUR
T1 - GaN microcavities formed by laser lift-off and plasma etching
AU - Martin, Robert
AU - Kim, H.S.
AU - Cho, Y.
AU - Edwards, P.R.
AU - Watson, I.M.
AU - Sands, T.
AU - Cheung, N.W.
AU - Dawson, M.D.
PY - 2002/5/30
Y1 - 2002/5/30
N2 - Photoluminescence measurements are used to investigate GaN microcavities formed between two all-oxide distributed Bragg reflectors. The structures are fabricated using a combination of laser lift-off to separate MOVPE-grown epitaxial GaN layers from their sapphire substrates, inductively coupled plasma etching to thin the GaN and electron-beam evaporation to deposit silica/zirconia multilayer mirrors. The first mirror is deposited on the as-grown GaN surface before bonding to a silicon substrate for the laser lift-off process, which uses a 248 nm KrF laser to selectively decompose GaN at the GaN/sapphire interface. The second dielectric mirror is deposited on the GaN surface exposed by the substrate removal, in some cases following an etch-back stage. This etch-back, achieved using inductively coupled plasma and wet chemical etching, allows removal of the low-quality GaN nucleation layer, control of the cavity length and modification of the exposed surface. Photoluminescence measurements demonstrate cavity-filtered luminescence from both etched and non-etched microcavities. Analysis of the observed modes gives cavity finesses of approximately 10 for 2.0 and 0.8 μm GaN cavities fabricated from the same wafer, indicating that the etch-back has had little effect on microcavity quality.
AB - Photoluminescence measurements are used to investigate GaN microcavities formed between two all-oxide distributed Bragg reflectors. The structures are fabricated using a combination of laser lift-off to separate MOVPE-grown epitaxial GaN layers from their sapphire substrates, inductively coupled plasma etching to thin the GaN and electron-beam evaporation to deposit silica/zirconia multilayer mirrors. The first mirror is deposited on the as-grown GaN surface before bonding to a silicon substrate for the laser lift-off process, which uses a 248 nm KrF laser to selectively decompose GaN at the GaN/sapphire interface. The second dielectric mirror is deposited on the GaN surface exposed by the substrate removal, in some cases following an etch-back stage. This etch-back, achieved using inductively coupled plasma and wet chemical etching, allows removal of the low-quality GaN nucleation layer, control of the cavity length and modification of the exposed surface. Photoluminescence measurements demonstrate cavity-filtered luminescence from both etched and non-etched microcavities. Analysis of the observed modes gives cavity finesses of approximately 10 for 2.0 and 0.8 μm GaN cavities fabricated from the same wafer, indicating that the etch-back has had little effect on microcavity quality.
KW - nitride semiconductors
KW - microcavity
KW - laser lift-off
KW - GaN
KW - luminescence
UR - http://dx.doi.org/10.1016/S0921-5107(02)00042-9
U2 - 10.1016/S0921-5107(02)00042-9
DO - 10.1016/S0921-5107(02)00042-9
M3 - Article
VL - 93
SP - 98
EP - 101
JO - Materials Science and Engineering B
JF - Materials Science and Engineering B
SN - 0921-5107
IS - 1-3
ER -