Foundry SiN as a platform for heterogeneous integration at visible wavelengths

Jack A. Smith; Zhibo Li; Saprtarsi Ghosh; Henry Francis; Gabriele Navickaite; Loyd J. McKnight; Rachel A. Oliver; Martin D. Dawson; Michael J. Strain

doi:10.1109/sum57928.2023.10224480

Foundry SiN as a platform for heterogeneous integration at visible wavelengths

Jack A. Smith, Zhibo Li, Saprtarsi Ghosh, Henry Francis, Gabriele Navickaite, Loyd J. McKnight, Rachel A. Oliver, Martin D. Dawson, Michael J. Strain

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

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Abstract

Silicon nitride (Si 3 N 4 ) is an excellent material platform for visible wavelength photonic integrated circuits, in particular, as a host for the heterogeneous/hybrid integration of complementary materials. In this work, we characterise the performance of the Si 3 N 4 from LIGENTEC as a base for hybrid integration.

Original language	English
Title of host publication	2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)
Place of Publication	Piscataway, NJ
Publisher	IEEE
Number of pages	2
ISBN (Electronic)	9798350347203
ISBN (Print)	9798350347203, 9798350347210
DOIs	https://doi.org/10.1109/sum57928.2023.10224480
Publication status	Published - 23 Aug 2023

Publication series

Name	2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)
Publisher	IEEE
ISSN (Electronic)	2376-8614

Funding

This work was supported by the Royal Academy of Engineering (Research Chairs and Senior Research Fellowships), Engineering and Physical Sciences Research Council (EP/R03480X/1, EP/V004859/1) and Innovate UK (50414). Author G. N. acknowledges funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No 898074 (POTION).

Keywords

silicon nitride
photonic integrated circuit
visible
heterogeneous integration

Access to Document

10.1109/sum57928.2023.10224480

Smith-etal-IEEE-SUM2023-Foundry-SiN-as-a-platform-for-heterogeneous-integrationAccepted author manuscript, 1.63 MBLicence: Strath_1

Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)
Strain, M. (Principal Investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/12/20 → 31/05/24
Project: Research
'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
Dawson, M. (Principal Investigator), Martin, R. (Co-investigator), Strain, M. (Co-investigator), Watson, I. (Co-investigator) & Guilhabert, B. J. E. (Research Co-investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/06/18 → 31/05/24
Project: Research

Cite this

Smith, J. A., Li, Z., Ghosh, S., Francis, H., Navickaite, G., McKnight, L. J., Oliver, R. A., Dawson, M. D., & Strain, M. J. (2023). Foundry SiN as a platform for heterogeneous integration at visible wavelengths. In 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM) (2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)). IEEE. https://doi.org/10.1109/sum57928.2023.10224480

@inproceedings{5b51875bc16042f2bc577c0c71603f02,

title = "Foundry SiN as a platform for heterogeneous integration at visible wavelengths",

abstract = "Silicon nitride (Si 3 N 4 ) is an excellent material platform for visible wavelength photonic integrated circuits, in particular, as a host for the heterogeneous/hybrid integration of complementary materials. In this work, we characterise the performance of the Si 3 N 4 from LIGENTEC as a base for hybrid integration.",

keywords = "silicon nitride, photonic integrated circuit, visible, heterogeneous integration",

author = "Smith, \{Jack A.\} and Zhibo Li and Saprtarsi Ghosh and Henry Francis and Gabriele Navickaite and McKnight, \{Loyd J.\} and Oliver, \{Rachel A.\} and Dawson, \{Martin D.\} and Strain, \{Michael J.\}",

year = "2023",

month = aug,

day = "23",

doi = "10.1109/sum57928.2023.10224480",

language = "English",

isbn = "9798350347203",

series = "2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)",

publisher = "IEEE",

booktitle = "2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)",

}

Smith, JA, Li, Z, Ghosh, S, Francis, H, Navickaite, G, McKnight, LJ, Oliver, RA, Dawson, MD & Strain, MJ 2023, Foundry SiN as a platform for heterogeneous integration at visible wavelengths. in 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM). 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM), IEEE, Piscataway, NJ. https://doi.org/10.1109/sum57928.2023.10224480

Foundry SiN as a platform for heterogeneous integration at visible wavelengths. / Smith, Jack A.; Li, Zhibo; Ghosh, Saprtarsi et al.
2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM). Piscataway, NJ: IEEE, 2023. (2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

TY - GEN

T1 - Foundry SiN as a platform for heterogeneous integration at visible wavelengths

AU - Smith, Jack A.

AU - Li, Zhibo

AU - Ghosh, Saprtarsi

AU - Francis, Henry

AU - Navickaite, Gabriele

AU - McKnight, Loyd J.

AU - Oliver, Rachel A.

AU - Dawson, Martin D.

AU - Strain, Michael J.

PY - 2023/8/23

Y1 - 2023/8/23

N2 - Silicon nitride (Si 3 N 4 ) is an excellent material platform for visible wavelength photonic integrated circuits, in particular, as a host for the heterogeneous/hybrid integration of complementary materials. In this work, we characterise the performance of the Si 3 N 4 from LIGENTEC as a base for hybrid integration.

AB - Silicon nitride (Si 3 N 4 ) is an excellent material platform for visible wavelength photonic integrated circuits, in particular, as a host for the heterogeneous/hybrid integration of complementary materials. In this work, we characterise the performance of the Si 3 N 4 from LIGENTEC as a base for hybrid integration.

KW - silicon nitride

KW - photonic integrated circuit

KW - visible

KW - heterogeneous integration

U2 - 10.1109/sum57928.2023.10224480

DO - 10.1109/sum57928.2023.10224480

M3 - Conference contribution book

SN - 9798350347203

SN - 9798350347210

T3 - 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)

BT - 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM)

PB - IEEE

CY - Piscataway, NJ

ER -

Foundry SiN as a platform for heterogeneous integration at visible wavelengths

Abstract

Publication series

Funding

Keywords

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Projects

Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)

'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing

Cite this