Projects per year
Abstract
Silicon nitride (Si 3 N 4 ) is an excellent material platform for visible wavelength photonic integrated circuits, in particular, as a host for the heterogeneous/hybrid integration of complementary materials. In this work, we characterise the performance of the Si 3 N 4 from LIGENTEC as a base for hybrid integration.
Original language | English |
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Title of host publication | 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM) |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Number of pages | 2 |
ISBN (Electronic) | 9798350347203 |
ISBN (Print) | 9798350347203, 9798350347210 |
DOIs | |
Publication status | Published - 23 Aug 2023 |
Publication series
Name | 2023 IEEE Photonics Society Summer Topicals Meeting Series (SUM) |
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Publisher | IEEE |
ISSN (Electronic) | 2376-8614 |
Keywords
- silicon nitride
- photonic integrated circuit
- visible
- heterogeneous integration
Fingerprint
Dive into the research topics of 'Foundry SiN as a platform for heterogeneous integration at visible wavelengths'. Together they form a unique fingerprint.Projects
- 2 Finished
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Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)
Strain, M. (Principal Investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/12/20 → 31/05/24
Project: Research
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'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
Dawson, M. (Principal Investigator), Martin, R. (Co-investigator), Strain, M. (Co-investigator), Watson, I. (Co-investigator) & Guilhabert, B. J. E. (Research Co-investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/06/18 → 31/05/24
Project: Research