TY - JOUR
T1 - Fiber-to-waveguide alignment assisted by a transparent integrated light monitor
AU - Carminati, Marco
AU - Grillanda, Stefano
AU - Ciccarella, Pietro
AU - Ferrari, Giorgio
AU - Strain, Michael J.
AU - Sampietro, Marco
AU - Melloni, Andrea
AU - Morichetti, Francesco
N1 - (c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
PY - 2015/3/1
Y1 - 2015/3/1
N2 - A novel fiber-to-waveguide alignment technique assisted by a transparent integrated light monitor is presented. The waveguide power is measured near the chip input facet by the contactless integrated photonic probe, which provides a feedback electrical signal steering the fiber positioning system. Automated single fiber to silicon nanowaveguide coupling is demonstrated with 40-nm resolution in a time scale of few seconds. The presented approach makes the fiber alignment procedure independent of the optical circuit integrated on the photonic chip, avoiding the need for simultaneous alignment of an output fiber, and thus easing optical chip characterization, wafer-level testing, and packaging of photonic devices.
AB - A novel fiber-to-waveguide alignment technique assisted by a transparent integrated light monitor is presented. The waveguide power is measured near the chip input facet by the contactless integrated photonic probe, which provides a feedback electrical signal steering the fiber positioning system. Automated single fiber to silicon nanowaveguide coupling is demonstrated with 40-nm resolution in a time scale of few seconds. The presented approach makes the fiber alignment procedure independent of the optical circuit integrated on the photonic chip, avoiding the need for simultaneous alignment of an output fiber, and thus easing optical chip characterization, wafer-level testing, and packaging of photonic devices.
KW - integrated optics
KW - optical fiber coupling
KW - optical power monitor
KW - optical waveguides
KW - packaging
KW - silicon photonics
UR - http://www.scopus.com/inward/record.url?scp=84923133802&partnerID=8YFLogxK
UR - http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=68
U2 - 10.1109/LPT.2014.2383495
DO - 10.1109/LPT.2014.2383495
M3 - Article
AN - SCOPUS:84923133802
SN - 1041-1135
VL - 27
SP - 510
EP - 513
JO - IEEE Photonics Technology Letters
JF - IEEE Photonics Technology Letters
IS - 5
M1 - 6990520
ER -