Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhipeng Li, Feihu Zhang, Yong Zhang, Xichun Luo

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11 Citations (Scopus)

Abstract

Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultra-precision grinding experiments were performed on Reaction-bonded Silicon Carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plough stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane i.e. (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins was discussed, and a schematic model was proposed to clarify the relationship between plastic deformation induced defects and brittle fractures.
LanguageEnglish
JournalInternational Journal of Advanced Manufacturing Technology
Early online date8 Apr 2017
DOIs
Publication statusE-pub ahead of print - 8 Apr 2017

Fingerprint

Stacking faults
Silicon carbide
Brittle fracture
Electron microscopes
Schematic diagrams
Phase boundaries
Dislocations (crystals)
Piles
Raman spectroscopy
Atomic force microscopy
Plastic deformation
Grain boundaries
Impurities
Plastics
Defects
Microstructure
Scanning electron microscopy
Experiments

Keywords

  • ultra-precision grinding
  • ceramics
  • subsurface damage
  • stacking faults

Cite this

@article{2883cef18cd74aa0a0f6d41873edfd7a,
title = "Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC",
abstract = "Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultra-precision grinding experiments were performed on Reaction-bonded Silicon Carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plough stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane i.e. (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins was discussed, and a schematic model was proposed to clarify the relationship between plastic deformation induced defects and brittle fractures.",
keywords = "ultra-precision grinding, ceramics, subsurface damage, stacking faults",
author = "Zhipeng Li and Feihu Zhang and Yong Zhang and Xichun Luo",
year = "2017",
month = "4",
day = "8",
doi = "10.1007/s00170-017-0267-4",
language = "English",
journal = "International Journal of Advanced Manufacturing Technology",
issn = "0268-3768",

}

TY - JOUR

T1 - Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

AU - Li, Zhipeng

AU - Zhang, Feihu

AU - Zhang, Yong

AU - Luo, Xichun

PY - 2017/4/8

Y1 - 2017/4/8

N2 - Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultra-precision grinding experiments were performed on Reaction-bonded Silicon Carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plough stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane i.e. (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins was discussed, and a schematic model was proposed to clarify the relationship between plastic deformation induced defects and brittle fractures.

AB - Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultra-precision grinding experiments were performed on Reaction-bonded Silicon Carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plough stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane i.e. (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins was discussed, and a schematic model was proposed to clarify the relationship between plastic deformation induced defects and brittle fractures.

KW - ultra-precision grinding

KW - ceramics

KW - subsurface damage

KW - stacking faults

UR - https://link.springer.com/journal/170

U2 - 10.1007/s00170-017-0267-4

DO - 10.1007/s00170-017-0267-4

M3 - Article

JO - International Journal of Advanced Manufacturing Technology

T2 - International Journal of Advanced Manufacturing Technology

JF - International Journal of Advanced Manufacturing Technology

SN - 0268-3768

ER -