Abstract
In this study, optical emission spectroscopy (OES) was performed to detect etch end-point during the etching of GaN/AlGaN-based devices. In-situ OES experiments during the etching were carried out to measure the etch product signals of AlGaN/GaN heterostructures as well as single III-nitrides. A possibility of detecting etch end-point by OES was identified for both optoelectronic devices and electronic devices using etch product emissions such as Al (396.1 nm) and Ga (417.2 nm).
Original language | English |
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Pages (from-to) | 159-162 |
Number of pages | 4 |
Journal | Materials Science and Engineering B |
Volume | 82 |
Issue number | 1-3 |
DOIs | |
Publication status | Published - 22 May 2001 |
Keywords
- etch end point detection (EPD)
- OES
- AlGaN/GaN
- inductively-coupled cl-2/ar
- cl-2/bcl3 plasmas
- inp