Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han; Seyoung Lim; Janyoung  Bae; Yuchul Hwang; Sungsoo Lee; Selda Oterkus; Erdogan Madenci; Cagan Diyaroglu; Erkan Oterkus

doi:10.1109/ECTC.2015.7159799

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han, Seyoung Lim, Janyoung Bae, Yuchul Hwang, Sungsoo Lee, Selda Oterkus, Erdogan Madenci, Cagan Diyaroglu, Erkan Oterkus

Naval Architecture, Ocean And Marine Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

4 Citations (Scopus)

63 Downloads (Pure)

Abstract

The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration
time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

Original language	English
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	IEEE
Pages	1518-1523
Number of pages	5
DOIs	https://doi.org/10.1109/ECTC.2015.7159799
Publication status	Published - 2015
Event	2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Sheraton San Diego Hotel & Marina, San Diego, CA, USA, United States Duration: 26 May 2015 → 29 May 2015

Conference

Conference	2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Country	United States
City	San Diego, CA, USA
Period	26/05/15 → 29/05/15

Keywords

JEDEC moisture sensitivity level
equivalent acceleration test time
peridynamics (PD) theory
moisture induced failure
absorption
gain measurement
semiconductor device modeling
moisture concentration
reliability evaluation

Access to Document

10.1109/ECTC.2015.7159799

Han-etal-ECTC2015-equivalent-acceleration-assessment-of-jedec-moisture-sensitivity-levelsAccepted author manuscript, 516 KB

Conference web site

Fingerprint Dive into the research topics of 'Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics'. Together they form a unique fingerprint.

Cite this

Han, S., Lim, S., Bae, J., Hwang, Y., Lee, S., Oterkus, S., Madenci, E., Diyaroglu, C., & Oterkus, E. (2015). Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. In Proceedings - Electronic Components and Technology Conference (pp. 1518-1523). IEEE. https://doi.org/10.1109/ECTC.2015.7159799

@inproceedings{c97db366542d4c13974e33669cbe6ccd,

title = "Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics",

abstract = "The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent accelerationtime for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.",

keywords = "JEDEC moisture sensitivity level, equivalent acceleration test time, peridynamics (PD) theory, moisture induced failure, absorption, gain measurement, semiconductor device modeling, moisture concentration, reliability evaluation",

author = "Sungwon Han and Seyoung Lim and Janyoung Bae and Yuchul Hwang and Sungsoo Lee and Selda Oterkus and Erdogan Madenci and Cagan Diyaroglu and Erkan Oterkus",

note = "{\textcopyright} 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.; 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ; Conference date: 26-05-2015 Through 29-05-2015",

year = "2015",

doi = "10.1109/ECTC.2015.7159799",

language = "English",

pages = "1518--1523",

booktitle = "Proceedings - Electronic Components and Technology Conference",

publisher = "IEEE",

}

Han, S, Lim, S, Bae, J, Hwang, Y, Lee, S, Oterkus, S, Madenci, E, Diyaroglu, C & Oterkus, E 2015, Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 1518-1523, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, United States, 26/05/15. https://doi.org/10.1109/ECTC.2015.7159799

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. / Han, Sungwon; Lim, Seyoung; Bae, Janyoung ; Hwang, Yuchul; Lee, Sungsoo; Oterkus, Selda; Madenci, Erdogan; Diyaroglu, Cagan; Oterkus, Erkan.

Proceedings - Electronic Components and Technology Conference. IEEE, 2015. p. 1518-1523.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

TY - GEN

T1 - Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

AU - Han, Sungwon

AU - Lim, Seyoung

AU - Bae, Janyoung

AU - Hwang, Yuchul

AU - Lee, Sungsoo

AU - Oterkus, Selda

AU - Madenci, Erdogan

AU - Diyaroglu, Cagan

AU - Oterkus, Erkan

N1 - © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2015

Y1 - 2015

N2 - The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent accelerationtime for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

AB - The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent accelerationtime for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

KW - JEDEC moisture sensitivity level

KW - equivalent acceleration test time

KW - peridynamics (PD) theory

KW - moisture induced failure

KW - absorption

KW - gain measurement

KW - semiconductor device modeling

KW - moisture concentration

KW - reliability evaluation

UR - http://www.ectc.net/

U2 - 10.1109/ECTC.2015.7159799

DO - 10.1109/ECTC.2015.7159799

M3 - Conference contribution book

SP - 1518

EP - 1523

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

T2 - 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

Y2 - 26 May 2015 through 29 May 2015

ER -