Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han, Seyoung Lim, Janyoung Bae, Yuchul Hwang, Sungsoo Lee, Selda Oterkus, Erdogan Madenci, Cagan Diyaroglu, Erkan Oterkus

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

6 Citations (Scopus)
74 Downloads (Pure)


The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration
time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.
Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Number of pages5
Publication statusPublished - 2015
Event2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Sheraton San Diego Hotel & Marina, San Diego, CA, USA, United States
Duration: 26 May 201529 May 2015


Conference2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Country/TerritoryUnited States
CitySan Diego, CA, USA


  • JEDEC moisture sensitivity level
  • equivalent acceleration test time
  • peridynamics (PD) theory
  • moisture induced failure
  • absorption
  • gain measurement
  • semiconductor device modeling
  • moisture concentration
  • reliability evaluation


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