Enhancing 2D phased array sensitivity and bandwidth using in probe electronics

Jerzy Dziewierz; Anthony Gachagan

doi:10.1109/ULTSYM.2012.0600

Enhancing 2D phased array sensitivity and bandwidth using in probe electronics

Jerzy Dziewierz, Anthony Gachagan

Electronic And Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

1 Citation (Scopus)

Abstract

An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1k Omega impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.

Original language	English
Title of host publication	2012 IEEE International Ultrasonics Symposium (IUS) Proceedings
Place of Publication	9781467345620
Publisher	IEEE
Pages	2400-2403
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2012.0600
Publication status	Published - 2012
Event	IEEE International Ultrasonics Symposium 2012 - Dresden, Germany Duration: 7 Oct 2012 → 10 Oct 2012

Conference

Conference	IEEE International Ultrasonics Symposium 2012
Country/Territory	Germany
City	Dresden
Period	7/10/12 → 10/10/12

Keywords

ultrasonic array
electronics
2D phased array sensitivity
bandwidth
probe electronics

Access to Document

10.1109/ULTSYM.2012.0600

SAMULET Project 5 Task 5.1.3 Superplastic Forming and Task 5.5.2 Development of Inspection Methods for Novel Materials
Rosochowski, A. (Principal Investigator), Ewing, H. (Co-investigator) & Gachagan, A. (Co-investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/06/09 → 31/01/13
Project: Research

ARCHIE-WeSt (UOSHPC)
Martin, R. (Manager)
University Of Strathclyde
Facility/equipment: Facility

Cite this

@inproceedings{76f86177fd1045ae97addf15bf81da49,

title = "Enhancing 2D phased array sensitivity and bandwidth using in probe electronics",

abstract = "An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1k Omega impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.",

keywords = "ultrasonic array, electronics, 2D phased array sensitivity, bandwidth, probe electronics",

author = "Jerzy Dziewierz and Anthony Gachagan",

year = "2012",

doi = "10.1109/ULTSYM.2012.0600",

language = "English",

pages = "2400--2403",

booktitle = "2012 IEEE International Ultrasonics Symposium (IUS) Proceedings",

publisher = "IEEE",

note = "IEEE International Ultrasonics Symposium 2012 ; Conference date: 07-10-2012 Through 10-10-2012",

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TY - GEN

T1 - Enhancing 2D phased array sensitivity and bandwidth using in probe electronics

AU - Dziewierz, Jerzy

AU - Gachagan, Anthony

PY - 2012

Y1 - 2012

N2 - An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1k Omega impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.

AB - An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1k Omega impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.

KW - ultrasonic array

KW - electronics

KW - 2D phased array sensitivity

KW - bandwidth

KW - probe electronics

U2 - 10.1109/ULTSYM.2012.0600

DO - 10.1109/ULTSYM.2012.0600

M3 - Conference contribution book

SP - 2400

EP - 2403

BT - 2012 IEEE International Ultrasonics Symposium (IUS) Proceedings

PB - IEEE

CY - 9781467345620

T2 - IEEE International Ultrasonics Symposium 2012

Y2 - 7 October 2012 through 10 October 2012

ER -

Enhancing 2D phased array sensitivity and bandwidth using in probe electronics

Abstract

Conference

Keywords

Access to Document

Fingerprint

Projects

SAMULET Project 5 Task 5.1.3 Superplastic Forming and Task 5.5.2 Development of Inspection Methods for Novel Materials

Equipment

ARCHIE-WeSt (UOSHPC)

Cite this