Enhancing 2D phased array sensitivity and bandwidth using in probe electronics

Jerzy Dziewierz, Anthony Gachagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

1 Citation (Scopus)

Abstract

An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1k Omega impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.
Original languageEnglish
Title of host publication2012 IEEE International Ultrasonics Symposium (IUS) Proceedings
Place of Publication9781467345620
PublisherIEEE
Pages2400-2403
Number of pages4
DOIs
Publication statusPublished - 2012
EventIEEE International Ultrasonics Symposium 2012 - Dresden, Germany
Duration: 7 Oct 201210 Oct 2012

Conference

ConferenceIEEE International Ultrasonics Symposium 2012
CountryGermany
CityDresden
Period7/10/1210/10/12

Keywords

  • ultrasonic array
  • electronics
  • 2D phased array sensitivity
  • bandwidth
  • probe electronics

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    Dziewierz, J., & Gachagan, A. (2012). Enhancing 2D phased array sensitivity and bandwidth using in probe electronics. In 2012 IEEE International Ultrasonics Symposium (IUS) Proceedings (pp. 2400-2403). IEEE. https://doi.org/10.1109/ULTSYM.2012.0600