Abstract
The high-resolution electron backscatter diffraction technique was applied to study grain-size, misorientation distribution and texture, which affect resistivity substantially, in electrodeposited and subsequently annealed nano-scale (80 nm width) copper wires. Particular emphasis was given to the examination of the variation of the microstructural parameters and texture in the trench thickness direction. The bottom part of the wires was shown to be characterized by the largest proportion of low-angle boundaries and the lowest fraction of annealing twins. The crystallographic texture of the wires was also demonstrated to significantly change in thickness direction. Depending on the trench height, the close packed {111} plane was shown to align either with the side walls or the bottom surface.
| Language | English |
|---|---|
| Pages | 207-214 |
| Number of pages | 8 |
| Journal | Thin Solid Films |
| Volume | 539 |
| DOIs | |
| Publication status | Published - 31 Jul 2013 |
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Keywords
- copper
- electrodeposition
- electron backscatter diffraction
- nano-crystalline
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Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires. / Ke, Y.; Konkova, T.; Mironov, S.; Tamahashi, K.; Onuki, J.
In: Thin Solid Films, Vol. 539, 31.07.2013, p. 207-214.Research output: Contribution to journal › Article
TY - JOUR
T1 - Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires
AU - Ke, Y.
AU - Konkova, T.
AU - Mironov, S.
AU - Tamahashi, K.
AU - Onuki, J.
PY - 2013/7/31
Y1 - 2013/7/31
N2 - The high-resolution electron backscatter diffraction technique was applied to study grain-size, misorientation distribution and texture, which affect resistivity substantially, in electrodeposited and subsequently annealed nano-scale (80 nm width) copper wires. Particular emphasis was given to the examination of the variation of the microstructural parameters and texture in the trench thickness direction. The bottom part of the wires was shown to be characterized by the largest proportion of low-angle boundaries and the lowest fraction of annealing twins. The crystallographic texture of the wires was also demonstrated to significantly change in thickness direction. Depending on the trench height, the close packed {111} plane was shown to align either with the side walls or the bottom surface.
AB - The high-resolution electron backscatter diffraction technique was applied to study grain-size, misorientation distribution and texture, which affect resistivity substantially, in electrodeposited and subsequently annealed nano-scale (80 nm width) copper wires. Particular emphasis was given to the examination of the variation of the microstructural parameters and texture in the trench thickness direction. The bottom part of the wires was shown to be characterized by the largest proportion of low-angle boundaries and the lowest fraction of annealing twins. The crystallographic texture of the wires was also demonstrated to significantly change in thickness direction. Depending on the trench height, the close packed {111} plane was shown to align either with the side walls or the bottom surface.
KW - copper
KW - electrodeposition
KW - electron backscatter diffraction
KW - nano-crystalline
UR - http://www.scopus.com/inward/record.url?scp=84879414977&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2013.05.067
DO - 10.1016/j.tsf.2013.05.067
M3 - Article
VL - 539
SP - 207
EP - 214
JO - Thin Solid Films
T2 - Thin Solid Films
JF - Thin Solid Films
SN - 0040-6090
ER -