Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires

Y. Ke, T. Konkova, S. Mironov, K. Tamahashi, J. Onuki

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The high-resolution electron backscatter diffraction technique was applied to study grain-size, misorientation distribution and texture, which affect resistivity substantially, in electrodeposited and subsequently annealed nano-scale (80 nm width) copper wires. Particular emphasis was given to the examination of the variation of the microstructural parameters and texture in the trench thickness direction. The bottom part of the wires was shown to be characterized by the largest proportion of low-angle boundaries and the lowest fraction of annealing twins. The crystallographic texture of the wires was also demonstrated to significantly change in thickness direction. Depending on the trench height, the close packed {111} plane was shown to align either with the side walls or the bottom surface.

LanguageEnglish
Pages207-214
Number of pages8
JournalThin Solid Films
Volume539
DOIs
Publication statusPublished - 31 Jul 2013

Fingerprint

Electron diffraction
Copper
textures
Textures
wire
Wire
copper
diffraction
electrons
misalignment
proportion
examination
grain size
Annealing
electrical resistivity
annealing
high resolution
Direction compound

Keywords

  • copper
  • electrodeposition
  • electron backscatter diffraction
  • nano-crystalline

Cite this

Ke, Y. ; Konkova, T. ; Mironov, S. ; Tamahashi, K. ; Onuki, J. / Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires. In: Thin Solid Films. 2013 ; Vol. 539. pp. 207-214.
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Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires. / Ke, Y.; Konkova, T.; Mironov, S.; Tamahashi, K.; Onuki, J.

In: Thin Solid Films, Vol. 539, 31.07.2013, p. 207-214.

Research output: Contribution to journalArticle

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AU - Ke, Y.

AU - Konkova, T.

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AU - Onuki, J.

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