Electrodeposition of microstructures using a patterned anode

In this paper we report the transfer of micro-scale patterns by electrodeposition on to substrates without requiring them to be coated with a photoresist mask. This approach makes uses of a patterned tool which is placed in close proximity to the substrate in an electrochemical reactor. With an appropriate choice of electrochemical parameters, electrodeposition can be confined to regions corresponding to the exposed regions of the tool. Experiments indicate that the electrodeposition of copper features on to conductive substrates is possible using this approach. Copper lines of 100 μm width have been successfully replicated, but with some increase in dimension due to current spreading. This effect can be minimised by reducing the inter-electrode gap and employing an electrolyte with a low conductivity. It is also demonstrated that the tool can be used to pattern multiple substrates.