Electrodeposition of microstructures using a patterned anode

Qi-Bai Wu, T. A. Green, S. Roy

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

In this paper we report the transfer of micro-scale patterns by electrodeposition on to substrates without requiring them to be coated with a photoresist mask. This approach makes uses of a patterned tool which is placed in close proximity to the substrate in an electrochemical reactor. With an appropriate choice of electrochemical parameters, electrodeposition can be confined to regions corresponding to the exposed regions of the tool. Experiments indicate that the electrodeposition of copper features on to conductive substrates is possible using this approach. Copper lines of 100 μm width have been successfully replicated, but with some increase in dimension due to current spreading. This effect can be minimised by reducing the inter-electrode gap and employing an electrolyte with a low conductivity. It is also demonstrated that the tool can be used to pattern multiple substrates.

LanguageEnglish
Pages1229-1232
Number of pages4
JournalElectrochemistry Communications
Volume13
Issue number11
Early online date31 Aug 2011
DOIs
Publication statusPublished - 30 Nov 2011

Fingerprint

Electrodeposition
Anodes
Microstructure
Substrates
Copper
Photoresists
Electrolytes
Masks
Electrodes
Experiments

Keywords

  • copper
  • electrodeposition
  • etching
  • microfabrication
  • micro-scale patterns
  • pattern transfer
  • EnFACE
  • electrochemical parameters

Cite this

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title = "Electrodeposition of microstructures using a patterned anode",
abstract = "In this paper we report the transfer of micro-scale patterns by electrodeposition on to substrates without requiring them to be coated with a photoresist mask. This approach makes uses of a patterned tool which is placed in close proximity to the substrate in an electrochemical reactor. With an appropriate choice of electrochemical parameters, electrodeposition can be confined to regions corresponding to the exposed regions of the tool. Experiments indicate that the electrodeposition of copper features on to conductive substrates is possible using this approach. Copper lines of 100 μm width have been successfully replicated, but with some increase in dimension due to current spreading. This effect can be minimised by reducing the inter-electrode gap and employing an electrolyte with a low conductivity. It is also demonstrated that the tool can be used to pattern multiple substrates.",
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Electrodeposition of microstructures using a patterned anode. / Wu, Qi-Bai; Green, T. A.; Roy, S.

In: Electrochemistry Communications, Vol. 13, No. 11, 30.11.2011, p. 1229-1232.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Electrodeposition of microstructures using a patterned anode

AU - Wu, Qi-Bai

AU - Green, T. A.

AU - Roy, S.

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N2 - In this paper we report the transfer of micro-scale patterns by electrodeposition on to substrates without requiring them to be coated with a photoresist mask. This approach makes uses of a patterned tool which is placed in close proximity to the substrate in an electrochemical reactor. With an appropriate choice of electrochemical parameters, electrodeposition can be confined to regions corresponding to the exposed regions of the tool. Experiments indicate that the electrodeposition of copper features on to conductive substrates is possible using this approach. Copper lines of 100 μm width have been successfully replicated, but with some increase in dimension due to current spreading. This effect can be minimised by reducing the inter-electrode gap and employing an electrolyte with a low conductivity. It is also demonstrated that the tool can be used to pattern multiple substrates.

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KW - copper

KW - electrodeposition

KW - etching

KW - microfabrication

KW - micro-scale patterns

KW - pattern transfer

KW - EnFACE

KW - electrochemical parameters

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