Electrodeposition of Cu from a water-containing deep eutectic solvent

Research output: Contribution to conferencePoster

Abstract

Ionic Liquids (ILs) have been proposed as alternatives electrolytes for metal electrodeposition. Deep Eutectic Solvents (DESs) are a novel type of ILs tolerant to water. Moreover, DESs formulated from quaternary ammonium salts and hydrogen bond donors are promising electrolytes since they are water tolerant and they are available at a reasonable cost. Although DESs are hygroscopic and absorb water from the atmosphere, earlier studies to plate Cu have concentrated on low-water containing DESs (<0.5 wt% H2O). However, for DESs to become exploitable, metal deposition from water-containing electrolytes requires to be investigated. In this work, we have endeavoured to establish a quantitative correlation that might explain the effect of water content on the electrolyte and on Cu deposition process. The intrinsic concentration of water in the electrolyte was measured using Karl Fischer titration. Thereafter, to quantify the electrolyte uptake of water a time-dependant test was conducted. After adding various concentration of water to the electrolyte determined from the time-dependant experiment (3 to 15 wt%), the influence of water content was examined with polarisation experiments collected using a rotating disc electrode. Finally, Cu deposition was carried on steel substrata from electrolytes containing different weight percentages of water. Cu deposits were characterised with Scanning Electron Microscopy (SEM) (Figure 1) and Energy Dispersive X-ray Spectroscopy (EDS).Different water contents in the electrolyte reduced the viscosity of the liquid which promotes the diffusivity of Cu2+ ions in the liquid. As a result, the limiting currents of the process increased. Higher water content changed the morphology of Cu films. Even at low water content (~3 wt%), the current distribution on the deposits is non-uniform. Furthermore, adding H2O worsens the already uneven current distribution leading to less uniform Cu deposits.

Conference

Conference22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018
CountryJapan
CityTokyo
Period15/04/1818/04/18
Internet address

Fingerprint

Electrodeposition
Eutectics
Electrolytes
Water
Water content
Ionic Liquids
Deposits
Ionic liquids
Metals
Steel
Rotating disks
Liquids
Titration
Ammonium Compounds
Energy dispersive spectroscopy
Hydrogen bonds
Salts
Experiments
Viscosity
Ions

Keywords

  • electrodeposition
  • copper
  • deep eutectic solvents
  • water

Cite this

Valverde Armas, P. E., Roy, S., & Green, T. (2018). Electrodeposition of Cu from a water-containing deep eutectic solvent. Poster session presented at 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, Tokyo, Japan.
Valverde Armas, Priscila Estefania ; Roy, Sudipta ; Green, Todd. / Electrodeposition of Cu from a water-containing deep eutectic solvent. Poster session presented at 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, Tokyo, Japan.
@conference{0b1c82cb0c59440d921f90cdf6b238c7,
title = "Electrodeposition of Cu from a water-containing deep eutectic solvent",
abstract = "Ionic Liquids (ILs) have been proposed as alternatives electrolytes for metal electrodeposition. Deep Eutectic Solvents (DESs) are a novel type of ILs tolerant to water. Moreover, DESs formulated from quaternary ammonium salts and hydrogen bond donors are promising electrolytes since they are water tolerant and they are available at a reasonable cost. Although DESs are hygroscopic and absorb water from the atmosphere, earlier studies to plate Cu have concentrated on low-water containing DESs (<0.5 wt{\%} H2O). However, for DESs to become exploitable, metal deposition from water-containing electrolytes requires to be investigated. In this work, we have endeavoured to establish a quantitative correlation that might explain the effect of water content on the electrolyte and on Cu deposition process. The intrinsic concentration of water in the electrolyte was measured using Karl Fischer titration. Thereafter, to quantify the electrolyte uptake of water a time-dependant test was conducted. After adding various concentration of water to the electrolyte determined from the time-dependant experiment (3 to 15 wt{\%}), the influence of water content was examined with polarisation experiments collected using a rotating disc electrode. Finally, Cu deposition was carried on steel substrata from electrolytes containing different weight percentages of water. Cu deposits were characterised with Scanning Electron Microscopy (SEM) (Figure 1) and Energy Dispersive X-ray Spectroscopy (EDS).Different water contents in the electrolyte reduced the viscosity of the liquid which promotes the diffusivity of Cu2+ ions in the liquid. As a result, the limiting currents of the process increased. Higher water content changed the morphology of Cu films. Even at low water content (~3 wt{\%}), the current distribution on the deposits is non-uniform. Furthermore, adding H2O worsens the already uneven current distribution leading to less uniform Cu deposits.",
keywords = "electrodeposition, copper, deep eutectic solvents, water",
author = "{Valverde Armas}, {Priscila Estefania} and Sudipta Roy and Todd Green",
year = "2018",
month = "4",
day = "18",
language = "English",
note = "22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018 ; Conference date: 15-04-2018 Through 18-04-2018",
url = "http://topical22.ise-online.org/",

}

Valverde Armas, PE, Roy, S & Green, T 2018, 'Electrodeposition of Cu from a water-containing deep eutectic solvent' 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, Tokyo, Japan, 15/04/18 - 18/04/18, .

Electrodeposition of Cu from a water-containing deep eutectic solvent. / Valverde Armas, Priscila Estefania; Roy, Sudipta; Green, Todd.

2018. Poster session presented at 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, Tokyo, Japan.

Research output: Contribution to conferencePoster

TY - CONF

T1 - Electrodeposition of Cu from a water-containing deep eutectic solvent

AU - Valverde Armas, Priscila Estefania

AU - Roy, Sudipta

AU - Green, Todd

PY - 2018/4/18

Y1 - 2018/4/18

N2 - Ionic Liquids (ILs) have been proposed as alternatives electrolytes for metal electrodeposition. Deep Eutectic Solvents (DESs) are a novel type of ILs tolerant to water. Moreover, DESs formulated from quaternary ammonium salts and hydrogen bond donors are promising electrolytes since they are water tolerant and they are available at a reasonable cost. Although DESs are hygroscopic and absorb water from the atmosphere, earlier studies to plate Cu have concentrated on low-water containing DESs (<0.5 wt% H2O). However, for DESs to become exploitable, metal deposition from water-containing electrolytes requires to be investigated. In this work, we have endeavoured to establish a quantitative correlation that might explain the effect of water content on the electrolyte and on Cu deposition process. The intrinsic concentration of water in the electrolyte was measured using Karl Fischer titration. Thereafter, to quantify the electrolyte uptake of water a time-dependant test was conducted. After adding various concentration of water to the electrolyte determined from the time-dependant experiment (3 to 15 wt%), the influence of water content was examined with polarisation experiments collected using a rotating disc electrode. Finally, Cu deposition was carried on steel substrata from electrolytes containing different weight percentages of water. Cu deposits were characterised with Scanning Electron Microscopy (SEM) (Figure 1) and Energy Dispersive X-ray Spectroscopy (EDS).Different water contents in the electrolyte reduced the viscosity of the liquid which promotes the diffusivity of Cu2+ ions in the liquid. As a result, the limiting currents of the process increased. Higher water content changed the morphology of Cu films. Even at low water content (~3 wt%), the current distribution on the deposits is non-uniform. Furthermore, adding H2O worsens the already uneven current distribution leading to less uniform Cu deposits.

AB - Ionic Liquids (ILs) have been proposed as alternatives electrolytes for metal electrodeposition. Deep Eutectic Solvents (DESs) are a novel type of ILs tolerant to water. Moreover, DESs formulated from quaternary ammonium salts and hydrogen bond donors are promising electrolytes since they are water tolerant and they are available at a reasonable cost. Although DESs are hygroscopic and absorb water from the atmosphere, earlier studies to plate Cu have concentrated on low-water containing DESs (<0.5 wt% H2O). However, for DESs to become exploitable, metal deposition from water-containing electrolytes requires to be investigated. In this work, we have endeavoured to establish a quantitative correlation that might explain the effect of water content on the electrolyte and on Cu deposition process. The intrinsic concentration of water in the electrolyte was measured using Karl Fischer titration. Thereafter, to quantify the electrolyte uptake of water a time-dependant test was conducted. After adding various concentration of water to the electrolyte determined from the time-dependant experiment (3 to 15 wt%), the influence of water content was examined with polarisation experiments collected using a rotating disc electrode. Finally, Cu deposition was carried on steel substrata from electrolytes containing different weight percentages of water. Cu deposits were characterised with Scanning Electron Microscopy (SEM) (Figure 1) and Energy Dispersive X-ray Spectroscopy (EDS).Different water contents in the electrolyte reduced the viscosity of the liquid which promotes the diffusivity of Cu2+ ions in the liquid. As a result, the limiting currents of the process increased. Higher water content changed the morphology of Cu films. Even at low water content (~3 wt%), the current distribution on the deposits is non-uniform. Furthermore, adding H2O worsens the already uneven current distribution leading to less uniform Cu deposits.

KW - electrodeposition

KW - copper

KW - deep eutectic solvents

KW - water

UR - http://topical22.ise-online.org/

M3 - Poster

ER -

Valverde Armas PE, Roy S, Green T. Electrodeposition of Cu from a water-containing deep eutectic solvent. 2018. Poster session presented at 22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, Tokyo, Japan.