Electrodeposition of copper from deep eutectic solvents by using pulse current

Research output: Contribution to conferencePoster

Abstract

Cu electrodeposition is of great significance in various industries, such as electronics, sensors and aerospace. Electroplating is the main production process for the deposition of metallic Cu films. Traditionally the process was performed using aqueous solutions due to their convenience and low cost. However, such electrolytes suffer a number of drawbacks including poor deposit quality for some metals and pose serious environmental concerns, for example, when cyanide or chromium (VI) electrolytes are used. In addition, other metals with very negative reduction potentials, like aluminum and magnesium, cannot be plated from the aqueous solutions. Deep eutectic solvents, which are a type of room temperature molten salts, serve as the alternative and can overcome many of the limitations of aqueous solution.
The nature of the applied deposition current is another important factor. The application of direct current (DC) is the conventional method for plating metals. However, the deposit quality and metal properties are inadequate in many cases. One way of improving the deposits is by using additives, but these need to be monitored carefully to maintain performance. However, these issues can often be solved by applying pulse current (PC) without the use of additives. This research investigates the combined effects of using deep eutectic solvents and pulsed current deposition. The aim is to explore how they affect the morphology and microstructure of the metal deposit, with comparisons of the results to those obtained using aqueous solutions and direct current plating.

Conference

ConferenceChemEngUKDay 2017
CountryUnited Kingdom
CityBirmingham
Period27/03/1728/03/17
Internet address

Fingerprint

Electrodeposition
Eutectics
Copper
Deposits
Metals
Plating
Electrolytes
Cyanides
Electroplating
Aluminum
Magnesium
Molten materials
Chromium
Electronic equipment
Salts
Microstructure
Sensors
Costs
Industry
Temperature

Keywords

  • Cu electroplating
  • deep eutectic solvents (DES)
  • deposit quality
  • pulse current

Cite this

Su, X., Green, T., & Roy, S. (2017). Electrodeposition of copper from deep eutectic solvents by using pulse current. Poster session presented at ChemEngUKDay 2017, Birmingham, United Kingdom.
Su, Xiaomeng ; Green, Todd ; Roy, Sudipta. / Electrodeposition of copper from deep eutectic solvents by using pulse current. Poster session presented at ChemEngUKDay 2017, Birmingham, United Kingdom.1 p.
@conference{0de2c78d363a4d4fb3e2ea68f2a4ce5f,
title = "Electrodeposition of copper from deep eutectic solvents by using pulse current",
abstract = "Cu electrodeposition is of great significance in various industries, such as electronics, sensors and aerospace. Electroplating is the main production process for the deposition of metallic Cu films. Traditionally the process was performed using aqueous solutions due to their convenience and low cost. However, such electrolytes suffer a number of drawbacks including poor deposit quality for some metals and pose serious environmental concerns, for example, when cyanide or chromium (VI) electrolytes are used. In addition, other metals with very negative reduction potentials, like aluminum and magnesium, cannot be plated from the aqueous solutions. Deep eutectic solvents, which are a type of room temperature molten salts, serve as the alternative and can overcome many of the limitations of aqueous solution.The nature of the applied deposition current is another important factor. The application of direct current (DC) is the conventional method for plating metals. However, the deposit quality and metal properties are inadequate in many cases. One way of improving the deposits is by using additives, but these need to be monitored carefully to maintain performance. However, these issues can often be solved by applying pulse current (PC) without the use of additives. This research investigates the combined effects of using deep eutectic solvents and pulsed current deposition. The aim is to explore how they affect the morphology and microstructure of the metal deposit, with comparisons of the results to those obtained using aqueous solutions and direct current plating.",
keywords = "Cu electroplating, deep eutectic solvents (DES), deposit quality, pulse current",
author = "Xiaomeng Su and Todd Green and Sudipta Roy",
year = "2017",
month = "3",
day = "28",
language = "English",
note = "ChemEngUKDay 2017 ; Conference date: 27-03-2017 Through 28-03-2017",
url = "http://www.chemengdayuk.co.uk/",

}

Su, X, Green, T & Roy, S 2017, 'Electrodeposition of copper from deep eutectic solvents by using pulse current' ChemEngUKDay 2017, Birmingham, United Kingdom, 27/03/17 - 28/03/17, .

Electrodeposition of copper from deep eutectic solvents by using pulse current. / Su, Xiaomeng; Green, Todd; Roy, Sudipta.

2017. Poster session presented at ChemEngUKDay 2017, Birmingham, United Kingdom.

Research output: Contribution to conferencePoster

TY - CONF

T1 - Electrodeposition of copper from deep eutectic solvents by using pulse current

AU - Su, Xiaomeng

AU - Green, Todd

AU - Roy, Sudipta

PY - 2017/3/28

Y1 - 2017/3/28

N2 - Cu electrodeposition is of great significance in various industries, such as electronics, sensors and aerospace. Electroplating is the main production process for the deposition of metallic Cu films. Traditionally the process was performed using aqueous solutions due to their convenience and low cost. However, such electrolytes suffer a number of drawbacks including poor deposit quality for some metals and pose serious environmental concerns, for example, when cyanide or chromium (VI) electrolytes are used. In addition, other metals with very negative reduction potentials, like aluminum and magnesium, cannot be plated from the aqueous solutions. Deep eutectic solvents, which are a type of room temperature molten salts, serve as the alternative and can overcome many of the limitations of aqueous solution.The nature of the applied deposition current is another important factor. The application of direct current (DC) is the conventional method for plating metals. However, the deposit quality and metal properties are inadequate in many cases. One way of improving the deposits is by using additives, but these need to be monitored carefully to maintain performance. However, these issues can often be solved by applying pulse current (PC) without the use of additives. This research investigates the combined effects of using deep eutectic solvents and pulsed current deposition. The aim is to explore how they affect the morphology and microstructure of the metal deposit, with comparisons of the results to those obtained using aqueous solutions and direct current plating.

AB - Cu electrodeposition is of great significance in various industries, such as electronics, sensors and aerospace. Electroplating is the main production process for the deposition of metallic Cu films. Traditionally the process was performed using aqueous solutions due to their convenience and low cost. However, such electrolytes suffer a number of drawbacks including poor deposit quality for some metals and pose serious environmental concerns, for example, when cyanide or chromium (VI) electrolytes are used. In addition, other metals with very negative reduction potentials, like aluminum and magnesium, cannot be plated from the aqueous solutions. Deep eutectic solvents, which are a type of room temperature molten salts, serve as the alternative and can overcome many of the limitations of aqueous solution.The nature of the applied deposition current is another important factor. The application of direct current (DC) is the conventional method for plating metals. However, the deposit quality and metal properties are inadequate in many cases. One way of improving the deposits is by using additives, but these need to be monitored carefully to maintain performance. However, these issues can often be solved by applying pulse current (PC) without the use of additives. This research investigates the combined effects of using deep eutectic solvents and pulsed current deposition. The aim is to explore how they affect the morphology and microstructure of the metal deposit, with comparisons of the results to those obtained using aqueous solutions and direct current plating.

KW - Cu electroplating

KW - deep eutectic solvents (DES)

KW - deposit quality

KW - pulse current

M3 - Poster

ER -

Su X, Green T, Roy S. Electrodeposition of copper from deep eutectic solvents by using pulse current. 2017. Poster session presented at ChemEngUKDay 2017, Birmingham, United Kingdom.