Electrodeposition from ionic liquids by using pulse current

Xiaomeng Su, Sudipta Roy

Research output: Contribution to conferencePoster

31 Downloads (Pure)

Abstract

Metal electroplating is of great significance in various industries such as electronics, sensors and optics, traditionally the process was performed in aqueous solution. However, they suffer a number of drawbacks such as poor deposit quality for some metals and environmental concerns [1]. The ionic liquid can overcome these limitations by aqueous solution [2]. In addition, the plating process can also be improved by applying pulse current instead of conventional direct current [3]. Therefore, it is worthy to investigate the combination effect of the utilization of both ionic liquid and pulse current in metal deposition.
Original languageEnglish
Number of pages1
Publication statusPublished - 22 Jun 2016
EventUniversity of Strathclyde Faculty Research Presentation Day - University of Strathclyde, Glasgow, United Kingdom
Duration: 22 Jun 201622 Jun 2016

Workshop

WorkshopUniversity of Strathclyde Faculty Research Presentation Day
Country/TerritoryUnited Kingdom
CityGlasgow
Period22/06/1622/06/16

Keywords

  • metal electroplating
  • ionic liquid
  • plating process
  • pulse current

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