Electrodeposition from ionic liquids by using pulse current

Xiaomeng Su, Sudipta Roy

Research output: Contribution to conferencePoster

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Metal electroplating is of great significance in various industries such as electronics, sensors and optics, traditionally the process was performed in aqueous solution. However, they suffer a number of drawbacks such as poor deposit quality for some metals and environmental concerns [1]. The ionic liquid can overcome these limitations by aqueous solution [2]. In addition, the plating process can also be improved by applying pulse current instead of conventional direct current [3]. Therefore, it is worthy to investigate the combination effect of the utilization of both ionic liquid and pulse current in metal deposition.
Original languageEnglish
Number of pages1
Publication statusPublished - 22 Jun 2016
EventUniversity of Strathclyde Faculty Research Presentation Day - University of Strathclyde, Glasgow, United Kingdom
Duration: 22 Jun 201622 Jun 2016


WorkshopUniversity of Strathclyde Faculty Research Presentation Day
Country/TerritoryUnited Kingdom


  • metal electroplating
  • ionic liquid
  • plating process
  • pulse current


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