Electrochemical effect of copper gleam additives during copper electrodeposition

E. M. Bayungan Dela Pena, S. Roy

Research output: Contribution to journalArticle

1 Citation (Scopus)
19 Downloads (Pure)

Abstract

Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.
Original languageEnglish
Pages (from-to)158-164
Number of pages7
JournalTransactions of the Institute of Metal Finishing
Volume95
Issue number3
DOIs
Publication statusPublished - 16 May 2017

Fingerprint

Electrodeposition
electrodeposition
Copper
copper
nanofabrication
Microfabrication
Nanotechnology
Electrolytes
Particle accelerators
Cathodes
accelerators
cathodes
electrolytes
suppressors
fabrication
ion concentration
plating
Plating
Ions
chemistry

Keywords

  • nano fabrication
  • micro fabrication
  • electrochemical behaviour
  • maskless micro-patterning
  • supressors
  • accelerators
  • promoters
  • polarisation
  • copper reduction
  • copper plating
  • additives
  • Copper Gleam
  • EnFace

Cite this

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title = "Electrochemical effect of copper gleam additives during copper electrodeposition",
abstract = "Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.",
keywords = "nano fabrication, micro fabrication, electrochemical behaviour, maskless micro-patterning, supressors, accelerators, promoters, polarisation, copper reduction, copper plating, additives, Copper Gleam, EnFace",
author = "{Dela Pena}, {E. M. Bayungan} and S. Roy",
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Electrochemical effect of copper gleam additives during copper electrodeposition. / Dela Pena, E. M. Bayungan; Roy, S.

In: Transactions of the Institute of Metal Finishing, Vol. 95, No. 3, 16.05.2017, p. 158-164.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Electrochemical effect of copper gleam additives during copper electrodeposition

AU - Dela Pena, E. M. Bayungan

AU - Roy, S.

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N2 - Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.

AB - Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.

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