Electrochemical effect of copper gleam additives during copper electrodeposition

E. M. Bayungan Dela Pena, S. Roy

Research output: Contribution to journalArticle

1 Citation (Scopus)
20 Downloads (Pure)

Abstract

Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro- and nano-fabrication is unpredictable. This study reports the effect of a suppressor (Copper Gleam B), an accelerator (Copper Gleam A) and a promoter (Cl−) on the electrochemical behaviour of copper reduction. The three additives, when employed separately, were found to increase cathode polarisation. The combination of Copper Gleam B and Cl− showed strong inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the Copper Gleam B–Cl− mix increased the limiting current and suggested plating acceleration. These effects are interpreted in terms of the adsorption–desorption behaviour of the additives on the cathode surface.
Original languageEnglish
Pages (from-to)158-164
Number of pages7
JournalTransactions of the Institute of Metal Finishing
Volume95
Issue number3
DOIs
Publication statusPublished - 16 May 2017

Keywords

  • nano fabrication
  • micro fabrication
  • electrochemical behaviour
  • maskless micro-patterning
  • supressors
  • accelerators
  • promoters
  • polarisation
  • copper reduction
  • copper plating
  • additives
  • Copper Gleam
  • EnFace

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