Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system

S.E. Ingram, R.A. Pethrick, J.J. Liggat

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)
LanguageEnglish
Pages1206-1214
Number of pages8
JournalPolymer International
Volume57
Issue number11
DOIs
Publication statusPublished - Nov 2008

Fingerprint

Nanocomposites
Clay
Dapsone
Organoclay
Ethers
Polymers
Temperature
clay
Glass transition temperature
bisphenol F diglycidyl ether

Keywords

  • epoxy
  • clay
  • cure
  • exfoliation

Cite this

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abstract = "BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt{\%} resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright {\circledC} 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)",
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Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system. / Ingram, S.E.; Pethrick, R.A.; Liggat, J.J.

In: Polymer International, Vol. 57, No. 11, 11.2008, p. 1206-1214.

Research output: Contribution to journalArticle

TY - JOUR

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AU - Ingram, S.E.

AU - Pethrick, R.A.

AU - Liggat, J.J.

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N2 - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)

AB - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)

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