Abstract
BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure.
RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected.
CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry
(Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)
Original language | English |
---|---|
Pages (from-to) | 1206-1214 |
Number of pages | 8 |
Journal | Polymer International |
Volume | 57 |
Issue number | 11 |
DOIs | |
Publication status | Published - Nov 2008 |
Keywords
- epoxy
- clay
- cure
- exfoliation