Abstract
| Language | English |
|---|---|
| Pages | 1206-1214 |
| Number of pages | 8 |
| Journal | Polymer International |
| Volume | 57 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - Nov 2008 |
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Keywords
- epoxy
- clay
- cure
- exfoliation
Cite this
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Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system. / Ingram, S.E.; Pethrick, R.A.; Liggat, J.J.
In: Polymer International, Vol. 57, No. 11, 11.2008, p. 1206-1214.Research output: Contribution to journal › Article
TY - JOUR
T1 - Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system
AU - Ingram, S.E.
AU - Pethrick, R.A.
AU - Liggat, J.J.
N1 - http://suprimo.lib.strath.ac.uk/primo_library/libweb/action/search.do?cs=frb&frbg=5675518&fctN=facet_frbrgroupid&fctV=5675518&frbg=&dum=true&vid=SUVU01&vl(54032236UI0)=lsr02&vl(96071691UI1)=all_items&srt=rank&indx=1&dstmp=1270637438714&tab=local&ct=search&scp.scps=scope%3A(SU)&vl(freeText0)=Polymer%20international&fn=search&mode=Basic&dscnt=0
PY - 2008/11
Y1 - 2008/11
N2 - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)
AB - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)
KW - epoxy
KW - clay
KW - cure
KW - exfoliation
UR - http://dx.doi.org/10.1002/pi.2452
U2 - 10.1002/pi.2452
DO - 10.1002/pi.2452
M3 - Article
VL - 57
SP - 1206
EP - 1214
JO - Polymer International
T2 - Polymer International
JF - Polymer International
SN - 0959-8103
IS - 11
ER -