Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system

S.E. Ingram; R.A. Pethrick; J.J. Liggat

doi:10.1002/pi.2452

Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system

S.E. Ingram, R.A. Pethrick, J.J. Liggat

Pure And Applied Chemistry

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)

Original language	English
Pages (from-to)	1206-1214
Number of pages	8
Journal	Polymer International
Volume	57
Issue number	11
DOIs	https://doi.org/10.1002/pi.2452
Publication status	Published - Nov 2008

Keywords

epoxy
clay
cure
exfoliation

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10.1002/pi.2452

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title = "Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system",

abstract = "BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright {\textcopyright} 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)",

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AU - Ingram, S.E.

AU - Pethrick, R.A.

AU - Liggat, J.J.

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N2 - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)

AB - BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry (Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)

KW - epoxy

KW - clay

KW - cure

KW - exfoliation

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U2 - 10.1002/pi.2452

DO - 10.1002/pi.2452

M3 - Article

VL - 57

SP - 1206

EP - 1214

JO - Polymer International

JF - Polymer International

SN - 0959-8103

IS - 11

ER -

Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system

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Keywords

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