TY - GEN
T1 - Effects of crystallographic structure on machining performance with polycrystalline oxygen free copper by a single crystalline diamond micro-tool
AU - Ding, X
AU - Lee, L. C.
AU - Butler, D. L.
AU - Shaw, K. C.
PY - 2010/9/30
Y1 - 2010/9/30
N2 - A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 μm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
AB - A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 μm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
KW - crystallographic orientation
KW - micro-machining
KW - SCD micro- tool
UR - http://www.scopus.com/inward/record.url?scp=78650444038&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.447-448.31
DO - 10.4028/www.scientific.net/KEM.447-448.31
M3 - Conference contribution book
AN - SCOPUS:78650444038
SN - 9780878492565
VL - 447-448
T3 - Key Engineering Materials
SP - 31
EP - 35
BT - Advances in Precision Engineering
CY - Enfield, NH
T2 - ICoPE2010 and 13th ICPE International Conference on Precision Engineering
Y2 - 28 July 2010 through 30 July 2010
ER -