Abstract
A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 μm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
| Language | English |
|---|---|
| Title of host publication | Advances in Precision Engineering |
| Place of Publication | Enfield, NH |
| Pages | 31-35 |
| Number of pages | 5 |
| Volume | 447-448 |
| DOIs | |
| Publication status | Published - 30 Sep 2010 |
| Event | ICoPE2010 and 13th ICPE International Conference on Precision Engineering - , Singapore Duration: 28 Jul 2010 → 30 Jul 2010 |
Publication series
| Name | Key Engineering Materials |
|---|---|
| Volume | 447-448 |
| ISSN (Print) | 1013-9826 |
Conference
| Conference | ICoPE2010 and 13th ICPE International Conference on Precision Engineering |
|---|---|
| Country | Singapore |
| Period | 28/07/10 → 30/07/10 |
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Keywords
- crystallographic orientation
- micro-machining
- SCD micro- tool
Cite this
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Effects of crystallographic structure on machining performance with polycrystalline oxygen free copper by a single crystalline diamond micro-tool. / Ding, X; Lee, L. C.; Butler, D. L.; Shaw, K. C.
Advances in Precision Engineering. Vol. 447-448 Enfield, NH, 2010. p. 31-35 (Key Engineering Materials; Vol. 447-448).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book
TY - GEN
T1 - Effects of crystallographic structure on machining performance with polycrystalline oxygen free copper by a single crystalline diamond micro-tool
AU - Ding, X
AU - Lee, L. C.
AU - Butler, D. L.
AU - Shaw, K. C.
PY - 2010/9/30
Y1 - 2010/9/30
N2 - A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 μm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
AB - A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 μm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).
KW - crystallographic orientation
KW - micro-machining
KW - SCD micro- tool
UR - http://www.scopus.com/inward/record.url?scp=78650444038&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.447-448.31
DO - 10.4028/www.scientific.net/KEM.447-448.31
M3 - Conference contribution book
SN - 9780878492565
VL - 447-448
T3 - Key Engineering Materials
SP - 31
EP - 35
BT - Advances in Precision Engineering
CY - Enfield, NH
ER -