Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent

Chemistry

• Electrodeposition 100%
• Water Type 100%
• Deep Eutectic Solvent 100%
• Metal 12%
• Electrolyte 12%
• Solvent 8%
• Choline Chloride 8%
• Scanning Electron Microscopy 8%
• Industry 8%
• Disk 4%
• Spectroscopy 4%
• Donor 4%
• Ethylene Glycol 4%
• UV/VIS Spectroscopy 4%
• Polarization 4%
• Liquid Film 4%
• Alloy 4%
• Semiconductor 4%
• Limiting Current 4%
• Chemical Reaction Reagent 4%
• Weight 4%
• Storage 4%
• Aqueous Solution 4%
• Concentration 4%
• Steel 4%
• Conductivity 4%
• Titration 4%
• Hydrogen Bond 4%
• Ionic Liquid 4%
• Ammonium Salt 4%
• Energy Dispersive X-Ray Spectroscopy 4%
• Fischer Synthesis 4%

Material Science

• Electrodeposition 100%
• Copper 37%
• Electrolyte 12%
• Energy-Dispersive X-Ray Spectroscopy 12%
• Solvent 8%
• Scanning Electron Microscopy 8%
• Morphology 8%
• Electronics 4%
• Metal 4%
• Electroplating 4%
• Solution 4%
• Hydrogen Bonding 4%
• Conductivity 4%
• Semiconductor Material 4%
• Protective Atmosphere 4%
• Metal Deposition 4%
• Spring Steel 4%
• Alloy 4%
• Ionic Liquid 4%

Engineering

• Cu Film 4%