Effect of particle size and sintering temperature on densification during coupled multifield-activated microforming

Dong Lu, Yi Yang, Yi Qin, Gang Yang

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

In this paper, a novel sintering method is introduced for the forming of microcomponents in which the loose powders were loaded directly into the die, sintered with an external electric field, a thermal field, and an external stress field (called coupled multifields activation), where the fields were generated by a Gleeble thermal simulation instrument. Two kinds of 316L stainless steel powders of different particle sizes (20 and 70 μm) with no binder were sintered with microforming using a multifield coupling method. For particle size of 20 μm, a nearly fully densified microsintered compact (relative density is 99.2%) was manufactured at a relatively low sintering temperature (900 °C) and within a relatively short sintering time (4 min). The fluctuated temperature–time curve reveals that the rapid mass transfer of liquid phase is the dominant densification mechanism in the compacts with a starting particle size of 20 μm
LanguageEnglish
Number of pages8
JournalJournal of Materials Research
Volume27
Issue number20
Early online date24 Aug 2012
DOIs
Publication statusPublished - 2012

Fingerprint

densification
Densification
sintering
Sintering
Particle size
Powders
thermal simulation
Stainless Steel
Temperature
stress distribution
mass transfer
Binders
temperature
stainless steels
liquid phases
Mass transfer
Stainless steel
Chemical activation
Electric fields
activation

Keywords

  • particle size
  • sintering temperature
  • densification
  • coupled multifield-activated microforming

Cite this

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Effect of particle size and sintering temperature on densification during coupled multifield-activated microforming. / Lu, Dong; Yang, Yi; Qin, Yi; Yang, Gang.

In: Journal of Materials Research, Vol. 27, No. 20, 2012.

Research output: Contribution to journalArticle

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