Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

Y. Ke, T. Konkova, S. Mironov, J. Ohnuki

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Abstract

High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.
Original languageEnglish
Pages (from-to)198-201
Number of pages3
JournalLetters on Materials
Volume2
Issue number4
DOIs
Publication statusPublished - 31 Dec 2012

Keywords

  • electrodeposition
  • copper
  • structure
  • nano-crystalline
  • electron backscatter diffraction

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