High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.
- electron backscatter diffraction
Ke, Y., Konkova, T., Mironov, S., & Ohnuki, J. (2012). Effect of annealing temperature on structure of electrodeposited nano-scale copper wires. Letters on Materials, 2(4), 198-201. https://doi.org/10.22226/2410-3535-2012-4-198-201