Display assembly having flexible transistors on a flexible substrate: patent application

C Forbes; A. Gelbman; C.  Turner; Helena Gleskova; S. Wagner

Display assembly having flexible transistors on a flexible substrate: patent application

C Forbes (Inventor)
, A. Gelbman (Inventor)
, C. Turner (Inventor)
, Helena Gleskova (Inventor)
, S. Wagner (Inventor)

Electronic And Electrical Engineering

Research output: Patent

Abstract

The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

Original language	English
Patent number	WO2005022966 A2
IPC	7H 05K A
Publication status	Published - 10 Mar 2005

Keywords

thin films
polymide substrate
conductive properties

Cite this

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title = "Display assembly having flexible transistors on a flexible substrate: patent application",

abstract = "The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.",

keywords = "thin films, polymide substrate, conductive properties",

author = "C Forbes and A. Gelbman and C. Turner and Helena Gleskova and S. Wagner",

year = "2005",

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T1 - Display assembly having flexible transistors on a flexible substrate

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AU - Forbes, C

AU - Gelbman, A.

AU - Turner, C.

AU - Gleskova, Helena

AU - Wagner, S.

PY - 2005/3/10

Y1 - 2005/3/10

N2 - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

AB - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

KW - thin films

KW - polymide substrate

KW - conductive properties

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M3 - Patent

M1 - WO2005022966 A2

ER -

Display assembly having flexible transistors on a flexible substrate: patent application

Abstract

Keywords

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