Display assembly having flexible transistors on a flexible substrate: patent application

C Forbes (Inventor), A. Gelbman (Inventor), C. Turner (Inventor), Helena Gleskova (Inventor), S. Wagner (Inventor)

Research output: Patent

Abstract

The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
LanguageEnglish
Patent numberWO2005022966 A2
IPC7H 05K A
Publication statusPublished - 10 Mar 2005

Fingerprint

Transistors
Display devices
Patents and inventions
Substrates
Adhesion
Masks
Imaging techniques
Networks (circuits)

Keywords

  • thin films
  • polymide substrate
  • conductive properties

Cite this

Forbes, C., Gelbman, A., Turner, C., Gleskova, H., & Wagner, S. (2005). IPC No. 7H 05K A. Display assembly having flexible transistors on a flexible substrate: patent application. (Patent No. WO2005022966 A2).
Forbes, C (Inventor) ; Gelbman, A. (Inventor) ; Turner, C. (Inventor) ; Gleskova, Helena (Inventor) ; Wagner, S. (Inventor). / Display assembly having flexible transistors on a flexible substrate : patent application. IPC No.: 7H 05K A. Patent No.: WO2005022966 A2.
@misc{64073a275ac1410db0149ff62cb504ac,
title = "Display assembly having flexible transistors on a flexible substrate: patent application",
abstract = "The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.",
keywords = "thin films, polymide substrate, conductive properties",
author = "C Forbes and A. Gelbman and C. Turner and Helena Gleskova and S. Wagner",
year = "2005",
month = "3",
day = "10",
language = "English",
type = "Patent",
note = "WO2005022966 A2; 7H 05K A",

}

Forbes, C, Gelbman, A, Turner, C, Gleskova, H & Wagner, S 2005, Display assembly having flexible transistors on a flexible substrate: patent application, Patent No. WO2005022966 A2, IPC No. 7H 05K A.

Display assembly having flexible transistors on a flexible substrate : patent application. / Forbes, C (Inventor); Gelbman, A. (Inventor); Turner, C. (Inventor); Gleskova, Helena (Inventor); Wagner, S. (Inventor).

IPC No.: 7H 05K A. Patent No.: WO2005022966 A2.

Research output: Patent

TY - PAT

T1 - Display assembly having flexible transistors on a flexible substrate

T2 - patent application

AU - Forbes, C

AU - Gelbman, A.

AU - Turner, C.

AU - Gleskova, Helena

AU - Wagner, S.

PY - 2005/3/10

Y1 - 2005/3/10

N2 - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

AB - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

KW - thin films

KW - polymide substrate

KW - conductive properties

UR - http://www.patentlens.net/patentlens/patents.html?patnums=WO_2005_022966_A2&language=en&query=(WO2005022966%20in%20publication_number)&stemming=true&returnTo=patentnumber.html%3Fquery%3D%26stemming%3Dtrue%26patentNumber%3DWO2005022966%26collections%3DUS_B%2CEP_B%2CAU_B%2CUS_A%2CWO_A%2CAU_A%26language%3Den

M3 - Patent

M1 - WO2005022966 A2

ER -

Forbes C, Gelbman A, Turner C, Gleskova H, Wagner S, inventors. Display assembly having flexible transistors on a flexible substrate: patent application. 7H 05K A. 2005 Mar 10.