Display assembly having flexible transistors on a flexible substrate: patent application

C Forbes (Inventor), A. Gelbman (Inventor), C. Turner (Inventor), Helena Gleskova (Inventor), S. Wagner (Inventor)

Research output: Patent

Abstract

The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
Original languageEnglish
Patent numberWO2005022966 A2
IPC7H 05K A
Publication statusPublished - 10 Mar 2005

Keywords

  • thin films
  • polymide substrate
  • conductive properties

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