Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature

C. M. Hong, Helena Gleskova, S. Wagner

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

This chapter looks at direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature
LanguageEnglish
Title of host publicationFlat panel display materials III
Subtitle of host publicationvolume 471 - MRS proceedings
EditorsG. N. Parsons, R. T. Fulks, D. E. Slobodin, T. H. Yuzuriha
Place of PublicationWarrendale, PA
Pages35-40
Number of pages6
Volume471
Publication statusPublished - 10 Sep 1997
EventMRS Spring Meeting 1997 - San Francisco, United States
Duration: 31 Mar 19974 Apr 1997

Publication series

NameMRS Symposium Proceedings
PublisherMaterials Research Society
Volume471

Conference

ConferenceMRS Spring Meeting 1997
CountryUnited States
CitySan Francisco
Period31/03/974/04/97

Fingerprint

Copper
Temperature

Keywords

  • direct writing
  • lift-off patterning
  • copper lines
  • 200-degrees-C

Cite this

Hong, C. M., Gleskova, H., & Wagner, S. (1997). Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. In G. N. Parsons, R. T. Fulks, D. E. Slobodin, & T. H. Yuzuriha (Eds.), Flat panel display materials III : volume 471 - MRS proceedings (Vol. 471, pp. 35-40). (MRS Symposium Proceedings; Vol. 471). Warrendale, PA.
Hong, C. M. ; Gleskova, Helena ; Wagner, S. / Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. Flat panel display materials III : volume 471 - MRS proceedings. editor / G. N. Parsons ; R. T. Fulks ; D. E. Slobodin ; T. H. Yuzuriha. Vol. 471 Warrendale, PA, 1997. pp. 35-40 (MRS Symposium Proceedings).
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Hong, CM, Gleskova, H & Wagner, S 1997, Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. in GN Parsons, RT Fulks, DE Slobodin & TH Yuzuriha (eds), Flat panel display materials III : volume 471 - MRS proceedings. vol. 471, MRS Symposium Proceedings, vol. 471, Warrendale, PA, pp. 35-40, MRS Spring Meeting 1997, San Francisco, United States, 31/03/97.

Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. / Hong, C. M.; Gleskova, Helena; Wagner, S.

Flat panel display materials III : volume 471 - MRS proceedings. ed. / G. N. Parsons; R. T. Fulks; D. E. Slobodin; T. H. Yuzuriha. Vol. 471 Warrendale, PA, 1997. p. 35-40 (MRS Symposium Proceedings; Vol. 471).

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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Hong CM, Gleskova H, Wagner S. Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. In Parsons GN, Fulks RT, Slobodin DE, Yuzuriha TH, editors, Flat panel display materials III : volume 471 - MRS proceedings. Vol. 471. Warrendale, PA. 1997. p. 35-40. (MRS Symposium Proceedings).