Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature

C. M. Hong, Helena Gleskova, S. Wagner

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

This chapter looks at direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature
Original languageEnglish
Title of host publicationFlat panel display materials III
Subtitle of host publicationvolume 471 - MRS proceedings
EditorsG. N. Parsons, R. T. Fulks, D. E. Slobodin, T. H. Yuzuriha
Place of PublicationWarrendale, PA
Pages35-40
Number of pages6
Volume471
Publication statusPublished - 10 Sep 1997
EventMRS Spring Meeting 1997 - San Francisco, United States
Duration: 31 Mar 19974 Apr 1997

Publication series

NameMRS Symposium Proceedings
PublisherMaterials Research Society
Volume471

Conference

ConferenceMRS Spring Meeting 1997
CountryUnited States
CitySan Francisco
Period31/03/974/04/97

Keywords

  • direct writing
  • lift-off patterning
  • copper lines
  • 200-degrees-C

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    Hong, C. M., Gleskova, H., & Wagner, S. (1997). Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. In G. N. Parsons, R. T. Fulks, D. E. Slobodin, & T. H. Yuzuriha (Eds.), Flat panel display materials III : volume 471 - MRS proceedings (Vol. 471, pp. 35-40). (MRS Symposium Proceedings; Vol. 471)..