Dielectric spectroscopy technique to assess the durability of adhesively bonded composite joint structures

P. Boinard, W.M. Banks, R.A. Pethrick, Yasushi Miyano (Editor), Albert H. Cardon (Editor), Ken L. Reifsnicker (Editor), Hiroshi Fukada (Editor), Shinji Ogihara (Editor)

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Chapter on a dielectric spectroscopy technique to assess the durability of adhesively bonded composite joint structures.
Original languageEnglish
Title of host publicationDurability analysis of composite systems 2001: proceedings of the Fifth International Conference on Durability Analysis of Composite Systems
Place of PublicationLondon, UK
Pages101-108
Number of pages7
Publication statusPublished - 2002

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Keywords

  • dielectric spectroscopy
  • adhesive bonding
  • composite joint structures
  • mechanical engineering

Cite this

Boinard, P., Banks, W. M., Pethrick, R. A., Miyano, Y. (Ed.), Cardon, A. H. (Ed.), Reifsnicker, K. L. (Ed.), ... Ogihara, S. (Ed.) (2002). Dielectric spectroscopy technique to assess the durability of adhesively bonded composite joint structures. In Durability analysis of composite systems 2001: proceedings of the Fifth International Conference on Durability Analysis of Composite Systems (pp. 101-108). London, UK.