Dielectric non-destructive examination of ageing of adhesively bonded structures

G.T. Doyle, R.A. Pethrick, W.M. Banks, R.L. Crane

Research output: Contribution to conferencePaper


This paper describes the use of dielectric spectroscopy as a nondestructive method for monitoring first solvent ingress at elevated temperatures within aluminum adhesively bonded joints, and second, water uptake within carbon-fiber reinforced plastic (CFRP) bonded joints. Dielectric measurements were carried out in both frequency and time domains, allowing for changes in the dielectric permittivity and loss to be calculated.
Original languageEnglish
Number of pages10
Publication statusPublished - 2002


  • dielectric
  • non-destructive examination
  • ageing
  • adhesively
  • bonded structures

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