Dielectric analysis of ageing structural adhesives

S. Affrossman, W.M. Banks, R. Comrie, D. Hayward, R.A. Pethrick

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

Paper presenting a dielectric analysis of ageing structural adhesives.

Original language	English
Title of host publication	Proceedings of the 30th Annual Meeting of the Adhesion Society
Publication status	Published - 2007

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title = "Dielectric analysis of ageing structural adhesives",

abstract = "Paper presenting a dielectric analysis of ageing structural adhesives.",

keywords = "dielectric analysis, adhesives, structural engineering",

author = "S. Affrossman and W.M. Banks and R. Comrie and D. Hayward and R.A. Pethrick",

year = "2007",

language = "English",

booktitle = "Proceedings of the 30th Annual Meeting of the Adhesion Society",

}

TY - CHAP

T1 - Dielectric analysis of ageing structural adhesives

AU - Affrossman, S.

AU - Banks, W.M.

AU - Comrie, R.

AU - Hayward, D.

AU - Pethrick, R.A.

PY - 2007

Y1 - 2007

N2 - Paper presenting a dielectric analysis of ageing structural adhesives.

AB - Paper presenting a dielectric analysis of ageing structural adhesives.

KW - dielectric analysis

KW - adhesives

KW - structural engineering

UR - http://www.adhesionsociety.org/Publications/pubs.html CD-ROM

M3 - Chapter

BT - Proceedings of the 30th Annual Meeting of the Adhesion Society

ER -