Dielectric analysis of ageing structural adhesives

S. Affrossman, W.M. Banks, R. Comrie, D. Hayward, R.A. Pethrick

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Paper presenting a dielectric analysis of ageing structural adhesives.
Original languageEnglish
Title of host publicationProceedings of the 30th Annual Meeting of the Adhesion Society
Publication statusPublished - 2007

Keywords

  • dielectric analysis
  • adhesives
  • structural engineering

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