Developments in dielectric techniques for non-destructive examination

W.M. Banks, D. Hayward, R.A. Pethrick, G.S. Armstrong, R.L. Crane

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Paper on the development in dielectric techniques for non-destructive examination.
Original languageEnglish
Title of host publicationProceedings of the 25th Annual Meeting of The Adhesion Society
Place of PublicationFlorida, USA
Publication statusPublished - 2002

Keywords

  • dielectrics
  • mechanical engineering
  • adhesion

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