Development of a simple electroless method for depositing metallic Pt-Pd nanoparticles over wire gauge support for removal of hydrogen in a nuclear reactor

Kiran K. Sanap; Sawanta S. Mali; Deepak Tyagi; Ajit N. Shirsat; Suhas B. Phapale; Suresh B. Waghmode; Salil Varma

doi:10.3390/ma16196541

Development of a simple electroless method for depositing metallic Pt-Pd nanoparticles over wire gauge support for removal of hydrogen in a nuclear reactor

Kiran K. Sanap, Sawanta S. Mali, Deepak Tyagi, Ajit N. Shirsat, Suhas B. Phapale, Suresh B. Waghmode, Salil Varma

Pure And Applied Chemistry

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

2 Downloads (Pure)

Abstract

Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl₂ + PdCl₂ seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H₂ and O₂ recombination reactions for hydrogen mitigation applications in nuclear reactors.

Original language	English
Article number	6541
Number of pages	14
Journal	Materials
Volume	16
Issue number	19
DOIs	https://doi.org/10.3390/ma16196541
Publication status	Published - 3 Oct 2023

Funding

This research was supported by the National Research Foundation of Korea (NRF)–RS-2023-00248067.

Keywords

electroless deposition
platinum
palladium
formaldehyde
hydrogen mitigation

Access to Document

10.3390/ma16196541Licence: CC BY 4.0

Sanap-etal-Materials-2023-Development-of-a-simple-electroless-method-for-depositing-metallic-Pt-Pd-nanoparticlesFinal published version, 5.43 MBLicence: CC BY 4.0

Cite this

@article{884e18bf831249b6a2ca7d70b90d45ee,

title = "Development of a simple electroless method for depositing metallic Pt-Pd nanoparticles over wire gauge support for removal of hydrogen in a nuclear reactor",

abstract = "Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl2 + PdCl2 seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H2 and O2 recombination reactions for hydrogen mitigation applications in nuclear reactors.",

keywords = "electroless deposition, platinum, palladium, formaldehyde, hydrogen mitigation",

author = "Sanap, {Kiran K.} and Mali, {Sawanta S.} and Deepak Tyagi and Shirsat, {Ajit N.} and Phapale, {Suhas B.} and Waghmode, {Suresh B.} and Salil Varma",

year = "2023",

month = oct,

day = "3",

doi = "10.3390/ma16196541",

language = "English",

volume = "16",

journal = "Materials",

issn = "1996-1944",

publisher = "MDPI AG",

number = "19",

}

TY - JOUR

T1 - Development of a simple electroless method for depositing metallic Pt-Pd nanoparticles over wire gauge support for removal of hydrogen in a nuclear reactor

AU - Sanap, Kiran K.

AU - Mali, Sawanta S.

AU - Tyagi, Deepak

AU - Shirsat, Ajit N.

AU - Phapale, Suhas B.

AU - Waghmode, Suresh B.

AU - Varma, Salil

PY - 2023/10/3

Y1 - 2023/10/3

N2 - Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl2 + PdCl2 seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H2 and O2 recombination reactions for hydrogen mitigation applications in nuclear reactors.

AB - Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl2 + PdCl2 seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H2 and O2 recombination reactions for hydrogen mitigation applications in nuclear reactors.

KW - electroless deposition

KW - platinum

KW - palladium

KW - formaldehyde

KW - hydrogen mitigation

U2 - 10.3390/ma16196541

DO - 10.3390/ma16196541

M3 - Article

SN - 1996-1944

VL - 16

JO - Materials

JF - Materials

IS - 19

M1 - 6541

ER -

Development of a simple electroless method for depositing metallic Pt-Pd nanoparticles over wire gauge support for removal of hydrogen in a nuclear reactor

Abstract

Funding

Keywords

Access to Document

Fingerprint

Cite this