Design and ageing of adhesives for structural adhesive bonding - A review

Richard A Pethrick

Research output: Contribution to journalArticle

52 Citations (Scopus)

Abstract

This review outlines some of the issues which have to be addressed when selecting an adhesive for a particular structural adhesive bonding application. The designer may find that a number of adhesives provide the required load bearing properties and the selection may require a more detailed consideration of the processes involved in the fabrication of the joint, the temperature over which it is to work and the environment in which it will have to operate. The article attempts to provide the reader with an insight into the effects of factors such as time and temperature used in the cure process, details of the components in the mixture and the effects of various additives on the physical properties of the adhesives which are created. The performance of an adhesive may vary with time as a consequence of stress-induced changes which are triggered by thermal effects or by hygrothermal factors. The review considers joints created using metal substrates and carbon fibre composites. The performance and durability of an adhesive bond is critically dependent on the stability of the interface between the adhesive and adherend and is sensitive to the pre-treatment processes used in the creation of the bond. The review outlines how broadband dielectric measurements can be used to non-destructively monitor the cure of adhesive bonds and the processes involved in ageing of joint. The dielectric method gives an insight into the fundamental processes which are giving rise to the changes in the mechanical properties of the joint as they age.

LanguageEnglish
Pages349-379
Number of pages31
JournalProceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications
Volume229
Issue number5
Early online date14 Feb 2014
DOIs
Publication statusPublished - Oct 2015

Fingerprint

Adhesives
Aging of materials
Bearings (structural)
Thermal effects
Carbon fibers
Durability
Physical properties
Metals
Fabrication
Mechanical properties
Temperature
Composite materials
Substrates

Keywords

  • adhesive bonding
  • ageing structural adhesives
  • cure
  • dielectrics testing
  • joint design
  • non-destructive examination
  • surface pre-treatment
  • toughening mechanisms

Cite this

@article{dc3f0d3d92744709abc050f5214ce1c5,
title = "Design and ageing of adhesives for structural adhesive bonding - A review",
abstract = "This review outlines some of the issues which have to be addressed when selecting an adhesive for a particular structural adhesive bonding application. The designer may find that a number of adhesives provide the required load bearing properties and the selection may require a more detailed consideration of the processes involved in the fabrication of the joint, the temperature over which it is to work and the environment in which it will have to operate. The article attempts to provide the reader with an insight into the effects of factors such as time and temperature used in the cure process, details of the components in the mixture and the effects of various additives on the physical properties of the adhesives which are created. The performance of an adhesive may vary with time as a consequence of stress-induced changes which are triggered by thermal effects or by hygrothermal factors. The review considers joints created using metal substrates and carbon fibre composites. The performance and durability of an adhesive bond is critically dependent on the stability of the interface between the adhesive and adherend and is sensitive to the pre-treatment processes used in the creation of the bond. The review outlines how broadband dielectric measurements can be used to non-destructively monitor the cure of adhesive bonds and the processes involved in ageing of joint. The dielectric method gives an insight into the fundamental processes which are giving rise to the changes in the mechanical properties of the joint as they age.",
keywords = "adhesive bonding, ageing structural adhesives, cure, dielectrics testing, joint design, non-destructive examination, surface pre-treatment, toughening mechanisms",
author = "Pethrick, {Richard A}",
year = "2015",
month = "10",
doi = "10.1177/1464420714522981",
language = "English",
volume = "229",
pages = "349--379",
journal = "Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications",
issn = "1464-4207",
number = "5",

}

TY - JOUR

T1 - Design and ageing of adhesives for structural adhesive bonding - A review

AU - Pethrick, Richard A

PY - 2015/10

Y1 - 2015/10

N2 - This review outlines some of the issues which have to be addressed when selecting an adhesive for a particular structural adhesive bonding application. The designer may find that a number of adhesives provide the required load bearing properties and the selection may require a more detailed consideration of the processes involved in the fabrication of the joint, the temperature over which it is to work and the environment in which it will have to operate. The article attempts to provide the reader with an insight into the effects of factors such as time and temperature used in the cure process, details of the components in the mixture and the effects of various additives on the physical properties of the adhesives which are created. The performance of an adhesive may vary with time as a consequence of stress-induced changes which are triggered by thermal effects or by hygrothermal factors. The review considers joints created using metal substrates and carbon fibre composites. The performance and durability of an adhesive bond is critically dependent on the stability of the interface between the adhesive and adherend and is sensitive to the pre-treatment processes used in the creation of the bond. The review outlines how broadband dielectric measurements can be used to non-destructively monitor the cure of adhesive bonds and the processes involved in ageing of joint. The dielectric method gives an insight into the fundamental processes which are giving rise to the changes in the mechanical properties of the joint as they age.

AB - This review outlines some of the issues which have to be addressed when selecting an adhesive for a particular structural adhesive bonding application. The designer may find that a number of adhesives provide the required load bearing properties and the selection may require a more detailed consideration of the processes involved in the fabrication of the joint, the temperature over which it is to work and the environment in which it will have to operate. The article attempts to provide the reader with an insight into the effects of factors such as time and temperature used in the cure process, details of the components in the mixture and the effects of various additives on the physical properties of the adhesives which are created. The performance of an adhesive may vary with time as a consequence of stress-induced changes which are triggered by thermal effects or by hygrothermal factors. The review considers joints created using metal substrates and carbon fibre composites. The performance and durability of an adhesive bond is critically dependent on the stability of the interface between the adhesive and adherend and is sensitive to the pre-treatment processes used in the creation of the bond. The review outlines how broadband dielectric measurements can be used to non-destructively monitor the cure of adhesive bonds and the processes involved in ageing of joint. The dielectric method gives an insight into the fundamental processes which are giving rise to the changes in the mechanical properties of the joint as they age.

KW - adhesive bonding

KW - ageing structural adhesives

KW - cure

KW - dielectrics testing

KW - joint design

KW - non-destructive examination

KW - surface pre-treatment

KW - toughening mechanisms

UR - http://www.scopus.com/inward/record.url?scp=84940949257&partnerID=8YFLogxK

U2 - 10.1177/1464420714522981

DO - 10.1177/1464420714522981

M3 - Article

VL - 229

SP - 349

EP - 379

JO - Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

T2 - Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

JF - Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

SN - 1464-4207

IS - 5

ER -