@inbook{7f041f9e068e4ca89263a6c6da05ce00,
title = "Deformable electronic surfaces",
abstract = "In this paper a technological approach for the fabrication of deformable electronic surfaces is reviewed. The approach consists of the fabrication of thin film devices on a flat but deformable substrate such as a plastic or glass foil using conventional processing tools. After the fabrication, the foil can be deformed to other shapes by air pressure or stamping. A spherical cap shape is used as a model system. This deformation induces large stress in the substrate, which is plastically deformed. To avoid damage to the thin film devices, they are built on top of {"}hard{"} islands, which limit the strain in the devices to manageable levels. Amorphous silicon TFT's on silicon nitride islands show little qualitative change in characteristics after a plastic deformation of the substrate to strain levels over 5%. Interconnect lines between islands are subjected to a large strain if they are deposited and patterned before the substrate deformation, and require novel approaches.",
keywords = "thin-film transistors, devices, circuits, mechanical strain, amorphous-silicon ",
author = "Sturm, {J. C.} and Hsu, {P. I.} and Helena Gleskova and R. Bhattacharya and S. Wagner",
year = "2006",
doi = "10.1142/9789812773081_0020",
language = "English",
isbn = "9812568840",
volume = "41",
series = "Selected topics in electronics and systems ",
pages = "365--374",
editor = "H. Iwai and Y. Nishi and Shur, {M. S.} and H. Wong",
booktitle = "Frontiers in electronics",
note = "Workshop on Frontiers in Electronics (WOFE-04) ; Conference date: 17-12-2004 Through 23-12-2004",
}