CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling

Naser Ali; Husain Bahzad; Ali Alsayegh; Sayantan Mukherjee; Shikha A. Ebrahim; Nawaf F. Aljuwayhel

doi:10.1109/iCCECE55162.2022.9875081

CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling

Naser Ali, Husain Bahzad, Ali Alsayegh, Sayantan Mukherjee, Shikha A. Ebrahim, Nawaf F. Aljuwayhel

Design, Manufacturing And Engineering Management

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

Abstract

Cooling, thermal management, and creating a homogeneous temperature distribution on the processors using small and highly-efficient cooling systems are critical design issues. In this research, cooling of central processor unit (CPU) has been investigated via numerical simulations. First, the impact of fin configuration on the performance of an active cooling system was explored. Next, the effect of employing phase change materials (PCMs) in the system and their cooling performance were numerically simulated. According to the results, the CPU's operating temperature in cooling mode with pure water was found to be 68.6 °C. However, when PCMs and water were used for cooling (as a hybrid cooling system), the steady-state operating temperature was found to reduce by ~6%.

Original language	English
Title of host publication	Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022
Editors	Mahdi H. Miraz, Garfield Southal, Maaruf Ali, Andrew Ware
Place of Publication	Piscataway, N.J.
Publisher	IEEE
Pages	59-64
Number of pages	6
ISBN (Electronic)	9781665489805
DOIs	https://doi.org/10.1109/iCCECE55162.2022.9875081
Publication status	Published - 7 Sept 2022
Event	5th International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022 - Southend, United Kingdom Duration: 17 Aug 2022 → 18 Aug 2022

Conference

Conference	5th International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022
Country/Territory	United Kingdom
City	Southend
Period	17/08/22 → 18/08/22

Keywords

central processor unit
CPU cooling
fins
heat transfer
PCM
temperature distribution

Access to Document

10.1109/iCCECE55162.2022.9875081

Cite this

Ali, N., Bahzad, H., Alsayegh, A., Mukherjee, S., Ebrahim, S. A., & Aljuwayhel, N. F. (2022). CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling. In M. H. Miraz, G. Southal, M. Ali, & A. Ware (Eds.), Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022 (pp. 59-64). IEEE. https://doi.org/10.1109/iCCECE55162.2022.9875081

Ali, Naser ; Bahzad, Husain ; Alsayegh, Ali et al. / CPU thermal management : investigation of fins arrangements and hybrid water-phase change materials cooling. Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022. editor / Mahdi H. Miraz ; Garfield Southal ; Maaruf Ali ; Andrew Ware. Piscataway, N.J. : IEEE, 2022. pp. 59-64

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title = "CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling",

abstract = "Cooling, thermal management, and creating a homogeneous temperature distribution on the processors using small and highly-efficient cooling systems are critical design issues. In this research, cooling of central processor unit (CPU) has been investigated via numerical simulations. First, the impact of fin configuration on the performance of an active cooling system was explored. Next, the effect of employing phase change materials (PCMs) in the system and their cooling performance were numerically simulated. According to the results, the CPU's operating temperature in cooling mode with pure water was found to be 68.6 °C. However, when PCMs and water were used for cooling (as a hybrid cooling system), the steady-state operating temperature was found to reduce by ~6%.",

keywords = "central processor unit, CPU cooling, fins, heat transfer, PCM, temperature distribution",

author = "Naser Ali and Husain Bahzad and Ali Alsayegh and Sayantan Mukherjee and Ebrahim, {Shikha A.} and Aljuwayhel, {Nawaf F.}",

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booktitle = "Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022",

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note = "5th International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022 ; Conference date: 17-08-2022 Through 18-08-2022",

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Ali, N, Bahzad, H, Alsayegh, A, Mukherjee, S, Ebrahim, SA & Aljuwayhel, NF 2022, CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling. in MH Miraz, G Southal, M Ali & A Ware (eds), Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022. IEEE, Piscataway, N.J., pp. 59-64, 5th International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022, Southend, United Kingdom, 17/08/22. https://doi.org/10.1109/iCCECE55162.2022.9875081

CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling. / Ali, Naser; Bahzad, Husain; Alsayegh, Ali et al.
Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022. ed. / Mahdi H. Miraz; Garfield Southal; Maaruf Ali; Andrew Ware. Piscataway, N.J.: IEEE, 2022. p. 59-64.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

TY - GEN

T1 - CPU thermal management

T2 - 5th International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022

AU - Ali, Naser

AU - Bahzad, Husain

AU - Alsayegh, Ali

AU - Mukherjee, Sayantan

AU - Ebrahim, Shikha A.

AU - Aljuwayhel, Nawaf F.

PY - 2022/9/7

Y1 - 2022/9/7

N2 - Cooling, thermal management, and creating a homogeneous temperature distribution on the processors using small and highly-efficient cooling systems are critical design issues. In this research, cooling of central processor unit (CPU) has been investigated via numerical simulations. First, the impact of fin configuration on the performance of an active cooling system was explored. Next, the effect of employing phase change materials (PCMs) in the system and their cooling performance were numerically simulated. According to the results, the CPU's operating temperature in cooling mode with pure water was found to be 68.6 °C. However, when PCMs and water were used for cooling (as a hybrid cooling system), the steady-state operating temperature was found to reduce by ~6%.

AB - Cooling, thermal management, and creating a homogeneous temperature distribution on the processors using small and highly-efficient cooling systems are critical design issues. In this research, cooling of central processor unit (CPU) has been investigated via numerical simulations. First, the impact of fin configuration on the performance of an active cooling system was explored. Next, the effect of employing phase change materials (PCMs) in the system and their cooling performance were numerically simulated. According to the results, the CPU's operating temperature in cooling mode with pure water was found to be 68.6 °C. However, when PCMs and water were used for cooling (as a hybrid cooling system), the steady-state operating temperature was found to reduce by ~6%.

KW - central processor unit

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BT - Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022

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Ali N, Bahzad H, Alsayegh A, Mukherjee S, Ebrahim SA, Aljuwayhel NF. CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling. In Miraz MH, Southal G, Ali M, Ware A, editors, Proceedings - 2022 International Conference on Computing, Electronics and Communications Engineering. iCCECE 2022. Piscataway, N.J.: IEEE. 2022. p. 59-64 doi: 10.1109/iCCECE55162.2022.9875081

CPU thermal management: investigation of fins arrangements and hybrid water-phase change materials cooling

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