Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips

Andreas Tsiamis; Yifan Li; Camelia Dunare; Jamie R.K. Marland; Ewen O. Blair; Stewart Smith; Jonathan G. Terry; Srinjoy Mitra; Ian Underwood; Alan F. Murray; Anthony J. Walton

doi:10.1109/JMEMS.2020.3015964

Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips

Andreas Tsiamis^*, Yifan Li, Camelia Dunare, Jamie R.K. Marland, Ewen O. Blair, Stewart Smith, Jonathan G. Terry, Srinjoy Mitra, Ian Underwood, Alan F. Murray, Anthony J. Walton

^*Corresponding author for this work

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Abstract

This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.

Original language	English
Article number	9173531
Pages (from-to)	1245-1252
Number of pages	8
Journal	Journal of Microelectromechanical Systems
Volume	29
Issue number	5
Early online date	21 Aug 2020
DOIs	https://doi.org/10.1109/JMEMS.2020.3015964
Publication status	Published - 1 Oct 2020

Keywords

CMOS
maskless
more than Moore
on-chip
optical lithography
photomask
post-processing
spin-coating
spray-coating

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Tsiamis-etal-2020-Comparison-of-conventional-and-maskless-lithographic-techniques-for-More-than-MooreAccepted author manuscript, 8.29 MB

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Tsiamis, A., Li, Y., Dunare, C., Marland, J. R. K., Blair, E. O., Smith, S., Terry, J. G., Mitra, S., Underwood, I., Murray, A. F., & Walton, A. J. (2020). Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips. Journal of Microelectromechanical Systems, 29(5), 1245-1252. Article 9173531. https://doi.org/10.1109/JMEMS.2020.3015964

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title = "Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips",

abstract = "This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.",

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note = "{\textcopyright} 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.",

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Tsiamis, A, Li, Y, Dunare, C, Marland, JRK, Blair, EO, Smith, S, Terry, JG, Mitra, S, Underwood, I, Murray, AF & Walton, AJ 2020, 'Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips', Journal of Microelectromechanical Systems, vol. 29, no. 5, 9173531, pp. 1245-1252. https://doi.org/10.1109/JMEMS.2020.3015964

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AU - Li, Yifan

AU - Dunare, Camelia

AU - Marland, Jamie R.K.

AU - Blair, Ewen O.

AU - Smith, Stewart

AU - Terry, Jonathan G.

AU - Mitra, Srinjoy

AU - Underwood, Ian

AU - Murray, Alan F.

AU - Walton, Anthony J.

N1 - © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2020/10/1

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N2 - This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.

AB - This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.

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KW - post-processing

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Comparison of conventional and maskless lithographic techniques for More than Moore post-processing of foundry CMOS chips

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