Codeposition of Cu-Sn from ethaline deep eutectic solvent

Swatilekha Ghosh, Sudipta Roy

Research output: Contribution to journalArticle

Abstract

Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.

LanguageEnglish
JournalElectrochimica Acta
Early online date27 Apr 2015
DOIs
Publication statusE-pub ahead of print - 27 Apr 2015

Fingerprint

Tin
Eutectics
Copper
Deposits
Metals
Ethylene Glycol
Brass
Voltammetry
Choline
Ethylene glycol
Electrolytes
Cathodes
Current density
Polarization
Experiments

Keywords

  • choline chloride
  • copper-tin alloy
  • deep eutectic solvents
  • electrodeposition
  • ethaline

Cite this

@article{59592a2168e44a778185b679746021e8,
title = "Codeposition of Cu-Sn from ethaline deep eutectic solvent",
abstract = "Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.",
keywords = "choline chloride, copper-tin alloy, deep eutectic solvents, electrodeposition, ethaline",
author = "Swatilekha Ghosh and Sudipta Roy",
year = "2015",
month = "4",
day = "27",
doi = "10.1016/j.electacta.2015.04.138",
language = "English",
journal = "Electrochimica Acta",
issn = "0013-4686",

}

Codeposition of Cu-Sn from ethaline deep eutectic solvent. / Ghosh, Swatilekha; Roy, Sudipta.

In: Electrochimica Acta, 27.04.2015.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Codeposition of Cu-Sn from ethaline deep eutectic solvent

AU - Ghosh, Swatilekha

AU - Roy, Sudipta

PY - 2015/4/27

Y1 - 2015/4/27

N2 - Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.

AB - Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.

KW - choline chloride

KW - copper-tin alloy

KW - deep eutectic solvents

KW - electrodeposition

KW - ethaline

UR - http://www.scopus.com/inward/record.url?scp=84928796934&partnerID=8YFLogxK

UR - http://www.sciencedirect.com/science/article/pii/S0013468615010713

U2 - 10.1016/j.electacta.2015.04.138

DO - 10.1016/j.electacta.2015.04.138

M3 - Article

JO - Electrochimica Acta

T2 - Electrochimica Acta

JF - Electrochimica Acta

SN - 0013-4686

ER -