Characterization of tin films synthesized from ethaline deep eutectic solvent

Swatilekha Ghosh; Sudipta Roy

doi:10.1016/j.mseb.2014.09.014

Characterization of tin films synthesized from ethaline deep eutectic solvent

Swatilekha Ghosh^*, Sudipta Roy

^*Corresponding author for this work

Chemical And Process Engineering

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

Abstract

Tin (Sn) films were electrodeposited by galvanostatic method from ethaline deep eutectic solvent (DES), without any additives. The effect of various deposition parameters on the microstructure was studied. With increase in metal salt concentration from 0.01 to 0.1 M, changes in current-potential behaviour were observed in the polarization scans. This might be due to the existence of [SnCl₃]^-, [Sn₂Cl₅]^- complexes in ethaline DES. Smooth and homogeneous deposits were obtained on a steel substrate surface by applying current density of 1.57 × 10^-3 A/cm² at 25 °C. Under these conditions the deposition rate was found to be 0.1 ± 10% μm/min and current efficiency was obtained as 84 ± 3%. XRD analysis of the deposit confirmed the polycrystalline tetragonal structure with mostly (2 0 0) orientation having a crystallite size about 62 ± 16% nm along with an internal strain of 0.0031 ± 22%. The present deposition method is simple, economical and can be adapted for industrial applications.

Original language	English
Pages (from-to)	104-110
Number of pages	7
Journal	Materials Science and Engineering B
Volume	190
Early online date	1 Oct 2014
DOIs	https://doi.org/10.1016/j.mseb.2014.09.014
Publication status	Published - 31 Dec 2014

Keywords

choline chloride
deep eutectic solvent
electrodeposition
ethaline
tin

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title = "Characterization of tin films synthesized from ethaline deep eutectic solvent",

abstract = "Tin (Sn) films were electrodeposited by galvanostatic method from ethaline deep eutectic solvent (DES), without any additives. The effect of various deposition parameters on the microstructure was studied. With increase in metal salt concentration from 0.01 to 0.1 M, changes in current-potential behaviour were observed in the polarization scans. This might be due to the existence of [SnCl3]-, [Sn2Cl5]- complexes in ethaline DES. Smooth and homogeneous deposits were obtained on a steel substrate surface by applying current density of 1.57 × 10-3 A/cm2 at 25 °C. Under these conditions the deposition rate was found to be 0.1 ± 10% μm/min and current efficiency was obtained as 84 ± 3%. XRD analysis of the deposit confirmed the polycrystalline tetragonal structure with mostly (2 0 0) orientation having a crystallite size about 62 ± 16% nm along with an internal strain of 0.0031 ± 22%. The present deposition method is simple, economical and can be adapted for industrial applications.",

keywords = "choline chloride, deep eutectic solvent, electrodeposition, ethaline, tin",

author = "Swatilekha Ghosh and Sudipta Roy",

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T1 - Characterization of tin films synthesized from ethaline deep eutectic solvent

AU - Ghosh, Swatilekha

AU - Roy, Sudipta

PY - 2014/12/31

Y1 - 2014/12/31

N2 - Tin (Sn) films were electrodeposited by galvanostatic method from ethaline deep eutectic solvent (DES), without any additives. The effect of various deposition parameters on the microstructure was studied. With increase in metal salt concentration from 0.01 to 0.1 M, changes in current-potential behaviour were observed in the polarization scans. This might be due to the existence of [SnCl3]-, [Sn2Cl5]- complexes in ethaline DES. Smooth and homogeneous deposits were obtained on a steel substrate surface by applying current density of 1.57 × 10-3 A/cm2 at 25 °C. Under these conditions the deposition rate was found to be 0.1 ± 10% μm/min and current efficiency was obtained as 84 ± 3%. XRD analysis of the deposit confirmed the polycrystalline tetragonal structure with mostly (2 0 0) orientation having a crystallite size about 62 ± 16% nm along with an internal strain of 0.0031 ± 22%. The present deposition method is simple, economical and can be adapted for industrial applications.

AB - Tin (Sn) films were electrodeposited by galvanostatic method from ethaline deep eutectic solvent (DES), without any additives. The effect of various deposition parameters on the microstructure was studied. With increase in metal salt concentration from 0.01 to 0.1 M, changes in current-potential behaviour were observed in the polarization scans. This might be due to the existence of [SnCl3]-, [Sn2Cl5]- complexes in ethaline DES. Smooth and homogeneous deposits were obtained on a steel substrate surface by applying current density of 1.57 × 10-3 A/cm2 at 25 °C. Under these conditions the deposition rate was found to be 0.1 ± 10% μm/min and current efficiency was obtained as 84 ± 3%. XRD analysis of the deposit confirmed the polycrystalline tetragonal structure with mostly (2 0 0) orientation having a crystallite size about 62 ± 16% nm along with an internal strain of 0.0031 ± 22%. The present deposition method is simple, economical and can be adapted for industrial applications.

KW - choline chloride

KW - deep eutectic solvent

KW - electrodeposition

KW - ethaline

KW - tin

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DO - 10.1016/j.mseb.2014.09.014

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VL - 190

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JO - Materials Science and Engineering B

JF - Materials Science and Engineering B

ER -

Characterization of tin films synthesized from ethaline deep eutectic solvent

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Keywords

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