Annealing effect on the structure characteristics of nano-scale damascene copper lines

T. Konkova, S. Mironov, Y. Ke, J. Onuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process. 

LanguageEnglish
Title of host publication2013 IEEE International Interconnect Technology Conference, IITC 2013
Place of PublicationPiscataway, N.J.
PublisherIEEE
Number of pages3
ISBN (Print)9781479904389
DOIs
Publication statusPublished - 13 Jun 2013
Event2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan
Duration: 13 Jun 201315 Jun 2013

Conference

Conference2013 16th IEEE International Interconnect Technology Conference, IITC 2013
CountryJapan
CityKyoto
Period13/06/1315/06/13

Fingerprint

Crystal microstructure
Electron diffraction
Annealing
Copper
Grain growth
Electrodeposition
Textures
Temperature

Keywords

  • annealing
  • copper
  • electrodeposition
  • electron diffraction
  • grain growth
  • nanoparticles
  • reliability
  • educational institutions
  • grain boundaries
  • microstructure
  • thermal stability
  • Cu
  • EBSD maps
  • grain structure
  • grain texture
  • high-resolution electron backscatter diffraction
  • nanoscale damascene copper lines
  • pinning effect
  • second-phase particles

Cite this

Konkova, T., Mironov, S., Ke, Y., & Onuki, J. (2013). Annealing effect on the structure characteristics of nano-scale damascene copper lines. In 2013 IEEE International Interconnect Technology Conference, IITC 2013 [6615574] Piscataway, N.J.: IEEE. https://doi.org/10.1109/IITC.2013.6615574
Konkova, T. ; Mironov, S. ; Ke, Y. ; Onuki, J. / Annealing effect on the structure characteristics of nano-scale damascene copper lines. 2013 IEEE International Interconnect Technology Conference, IITC 2013. Piscataway, N.J. : IEEE, 2013.
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abstract = "High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process. ",
keywords = "annealing, copper, electrodeposition, electron diffraction, grain growth, nanoparticles, reliability, educational institutions, grain boundaries, microstructure, thermal stability, Cu, EBSD maps, grain structure, grain texture, high-resolution electron backscatter diffraction, nanoscale damascene copper lines, pinning effect, second-phase particles",
author = "T. Konkova and S. Mironov and Y. Ke and J. Onuki",
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Konkova, T, Mironov, S, Ke, Y & Onuki, J 2013, Annealing effect on the structure characteristics of nano-scale damascene copper lines. in 2013 IEEE International Interconnect Technology Conference, IITC 2013., 6615574, IEEE, Piscataway, N.J., 2013 16th IEEE International Interconnect Technology Conference, IITC 2013, Kyoto, Japan, 13/06/13. https://doi.org/10.1109/IITC.2013.6615574

Annealing effect on the structure characteristics of nano-scale damascene copper lines. / Konkova, T.; Mironov, S.; Ke, Y.; Onuki, J.

2013 IEEE International Interconnect Technology Conference, IITC 2013. Piscataway, N.J. : IEEE, 2013. 6615574.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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AU - Mironov, S.

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AU - Onuki, J.

N1 - © 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2013/6/13

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N2 - High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process. 

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Konkova T, Mironov S, Ke Y, Onuki J. Annealing effect on the structure characteristics of nano-scale damascene copper lines. In 2013 IEEE International Interconnect Technology Conference, IITC 2013. Piscataway, N.J.: IEEE. 2013. 6615574 https://doi.org/10.1109/IITC.2013.6615574