Annealing effect on the structure characteristics of nano-scale damascene copper lines

T. Konkova; S. Mironov; Y. Ke; J. Onuki

doi:10.1109/IITC.2013.6615574

Annealing effect on the structure characteristics of nano-scale damascene copper lines

T. Konkova, S. Mironov, Y. Ke, J. Onuki

Design, Manufacturing And Engineering Management

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

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Abstract

High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process.

Original language	English
Title of host publication	2013 IEEE International Interconnect Technology Conference, IITC 2013
Place of Publication	Piscataway, N.J.
Publisher	IEEE
Number of pages	3
ISBN (Print)	9781479904389
DOIs	https://doi.org/10.1109/IITC.2013.6615574
Publication status	Published - 13 Jun 2013
Event	2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan Duration: 13 Jun 2013 → 15 Jun 2013

Conference

Conference	2013 16th IEEE International Interconnect Technology Conference, IITC 2013
Country/Territory	Japan
City	Kyoto
Period	13/06/13 → 15/06/13

Keywords

annealing
copper
electrodeposition
electron diffraction
grain growth
nanoparticles
reliability
educational institutions
grain boundaries
microstructure
thermal stability
Cu
EBSD maps
grain structure
grain texture
high-resolution electron backscatter diffraction
nanoscale damascene copper lines
pinning effect
second-phase particles

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10.1109/IITC.2013.6615574

Konkova-etal-IITC2013-Structure-characteristics-of-nano-scale-damascene-copper-linesAccepted author manuscript, 695 KB

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title = "Annealing effect on the structure characteristics of nano-scale damascene copper lines",

abstract = "High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process. ",

keywords = "annealing, copper, electrodeposition, electron diffraction, grain growth, nanoparticles, reliability, educational institutions, grain boundaries, microstructure, thermal stability, Cu, EBSD maps, grain structure, grain texture, high-resolution electron backscatter diffraction, nanoscale damascene copper lines, pinning effect, second-phase particles",

author = "T. Konkova and S. Mironov and Y. Ke and J. Onuki",

note = "{\textcopyright} 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.; 2013 16th IEEE International Interconnect Technology Conference, IITC 2013 ; Conference date: 13-06-2013 Through 15-06-2013",

year = "2013",

month = jun,

day = "13",

doi = "10.1109/IITC.2013.6615574",

language = "English",

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booktitle = "2013 IEEE International Interconnect Technology Conference, IITC 2013",

publisher = "IEEE",

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Konkova, T, Mironov, S, Ke, Y & Onuki, J 2013, Annealing effect on the structure characteristics of nano-scale damascene copper lines. in 2013 IEEE International Interconnect Technology Conference, IITC 2013., 6615574, IEEE, Piscataway, N.J., 2013 16th IEEE International Interconnect Technology Conference, IITC 2013, Kyoto, Japan, 13/06/13. https://doi.org/10.1109/IITC.2013.6615574

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T1 - Annealing effect on the structure characteristics of nano-scale damascene copper lines

AU - Konkova, T.

AU - Mironov, S.

AU - Ke, Y.

AU - Onuki, J.

N1 - © 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2013/6/13

Y1 - 2013/6/13

N2 - High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process.

AB - High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process.

KW - annealing

KW - copper

KW - electrodeposition

KW - electron diffraction

KW - grain growth

KW - nanoparticles

KW - reliability

KW - educational institutions

KW - grain boundaries

KW - microstructure

KW - thermal stability

KW - Cu

KW - EBSD maps

KW - grain structure

KW - grain texture

KW - high-resolution electron backscatter diffraction

KW - nanoscale damascene copper lines

KW - pinning effect

KW - second-phase particles

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UR - http://www.semiconportal.com/IITC2013/

U2 - 10.1109/IITC.2013.6615574

DO - 10.1109/IITC.2013.6615574

M3 - Conference contribution book

AN - SCOPUS:84886704315

SN - 9781479904389

BT - 2013 IEEE International Interconnect Technology Conference, IITC 2013

PB - IEEE

CY - Piscataway, N.J.

T2 - 2013 16th IEEE International Interconnect Technology Conference, IITC 2013

Y2 - 13 June 2013 through 15 June 2013

ER -

Annealing effect on the structure characteristics of nano-scale damascene copper lines

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