Abstract
The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.
Original language | English |
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Pages (from-to) | 178-189 |
Number of pages | 12 |
Journal | Materials Science and Engineering: A |
Volume | 585 |
DOIs | |
Publication status | Published - 15 Nov 2013 |
Keywords
- EBSD
- grain growth
- nanostructured materials
- recrystallization
- thermomechanical processing
- annealing