Annealing behavior of cryogenically-rolled copper

T. Konkova; S. Mironov; A. Korznikov; M. M. Myshlyaev; S. L. Semiatin

doi:10.1016/j.msea.2013.07.042

Annealing behavior of cryogenically-rolled copper

T. Konkova, S. Mironov^*, A. Korznikov, M. M. Myshlyaev, S. L. Semiatin

^*Corresponding author for this work

Design, Manufacturing And Engineering Management

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5T_m), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

Original language	English
Pages (from-to)	178-189
Number of pages	12
Journal	Materials Science and Engineering: A
Volume	585
DOIs	https://doi.org/10.1016/j.msea.2013.07.042
Publication status	Published - 15 Nov 2013

Keywords

EBSD
grain growth
nanostructured materials
recrystallization
thermomechanical processing
annealing

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10.1016/j.msea.2013.07.042

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title = "Annealing behavior of cryogenically-rolled copper",

abstract = "The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.",

keywords = "EBSD, grain growth, nanostructured materials, recrystallization, thermomechanical processing, annealing",

author = "T. Konkova and S. Mironov and A. Korznikov and Myshlyaev, {M. M.} and Semiatin, {S. L.}",

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T1 - Annealing behavior of cryogenically-rolled copper

AU - Konkova, T.

AU - Mironov, S.

AU - Korznikov, A.

AU - Myshlyaev, M. M.

AU - Semiatin, S. L.

PY - 2013/11/15

Y1 - 2013/11/15

N2 - The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

AB - The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

KW - EBSD

KW - grain growth

KW - nanostructured materials

KW - recrystallization

KW - thermomechanical processing

KW - annealing

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DO - 10.1016/j.msea.2013.07.042

M3 - Article

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SN - 0921-5093

VL - 585

SP - 178

EP - 189

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Annealing behavior of cryogenically-rolled copper

Abstract

Keywords

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