Annealing behavior of cryogenically-rolled copper

T. Konkova, S. Mironov, A. Korznikov, M. M. Myshlyaev, S. L. Semiatin

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

LanguageEnglish
Pages178-189
Number of pages12
JournalMaterials Science and Engineering: A
Volume585
DOIs
Publication statusPublished - 15 Nov 2013

Fingerprint

Copper
Annealing
copper
annealing
brasses
Brass
Grain growth
Temperature
temperature
textures
Textures
grain size
microstructure
Microstructure
brass

Keywords

  • EBSD
  • grain growth
  • nanostructured materials
  • recrystallization
  • thermomechanical processing
  • annealing

Cite this

Konkova, T., Mironov, S., Korznikov, A., Myshlyaev, M. M., & Semiatin, S. L. (2013). Annealing behavior of cryogenically-rolled copper. Materials Science and Engineering: A, 585, 178-189. https://doi.org/10.1016/j.msea.2013.07.042
Konkova, T. ; Mironov, S. ; Korznikov, A. ; Myshlyaev, M. M. ; Semiatin, S. L. / Annealing behavior of cryogenically-rolled copper. In: Materials Science and Engineering: A. 2013 ; Vol. 585. pp. 178-189.
@article{b71872f16a884452a3a7e35d5a14fe9f,
title = "Annealing behavior of cryogenically-rolled copper",
abstract = "The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.",
keywords = "EBSD, grain growth, nanostructured materials, recrystallization, thermomechanical processing, annealing",
author = "T. Konkova and S. Mironov and A. Korznikov and Myshlyaev, {M. M.} and Semiatin, {S. L.}",
year = "2013",
month = "11",
day = "15",
doi = "10.1016/j.msea.2013.07.042",
language = "English",
volume = "585",
pages = "178--189",
journal = "Materials Science and Engineering: A",
issn = "0921-5093",

}

Annealing behavior of cryogenically-rolled copper. / Konkova, T.; Mironov, S.; Korznikov, A.; Myshlyaev, M. M.; Semiatin, S. L.

In: Materials Science and Engineering: A, Vol. 585, 15.11.2013, p. 178-189.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Annealing behavior of cryogenically-rolled copper

AU - Konkova, T.

AU - Mironov, S.

AU - Korznikov, A.

AU - Myshlyaev, M. M.

AU - Semiatin, S. L.

PY - 2013/11/15

Y1 - 2013/11/15

N2 - The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

AB - The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

KW - EBSD

KW - grain growth

KW - nanostructured materials

KW - recrystallization

KW - thermomechanical processing

KW - annealing

UR - http://www.scopus.com/inward/record.url?scp=84881496963&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2013.07.042

DO - 10.1016/j.msea.2013.07.042

M3 - Article

VL - 585

SP - 178

EP - 189

JO - Materials Science and Engineering: A

T2 - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

SN - 0921-5093

ER -