Annealing behavior of cryogenically-rolled copper

T. Konkova, S. Mironov, A. Korznikov, M. M. Myshlyaev, S. L. Semiatin

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16 Citations (Scopus)

Abstract

The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950°C) was established. At temperatures below 350°C (~0.5Tm), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}〈385〉 (Brass-R), and {4;4;11}〈11;11;8〉 (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350°C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization.

Original languageEnglish
Pages (from-to)178-189
Number of pages12
JournalMaterials Science and Engineering: A
Volume585
DOIs
Publication statusPublished - 15 Nov 2013

Keywords

  • EBSD
  • grain growth
  • nanostructured materials
  • recrystallization
  • thermomechanical processing
  • annealing

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    Konkova, T., Mironov, S., Korznikov, A., Myshlyaev, M. M., & Semiatin, S. L. (2013). Annealing behavior of cryogenically-rolled copper. Materials Science and Engineering: A, 585, 178-189. https://doi.org/10.1016/j.msea.2013.07.042