Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers

P. Reynolds, J.E. Hyslop, G. Hayward

Research output: Contribution to conferencePaper

26 Citations (Scopus)

Abstract

1-3 piezocomposites provide for significant advantages over solid piezoceramic transducers for ultrasound applications, at the expense of introduction of additional spurious resonances. We examine in detail the generation of high frequency inter-pillar (lateral) resonances in 1-3 piezoelectric composites, through experiment and finite element analysis (FEA) with the PZFlex package. These inter-pillar modes are clearly shown to be generated due to Lamb waves propagating through the substrate between pillars, the magnitude of which varies dependent upon magnitude of displacement from the thickness mode vibration and its proximity in the frequency domain.
LanguageEnglish
Pages1650-1653
Number of pages3
DOIs
Publication statusPublished - Oct 2003
EventIEEE International Ultrasonics Symposium 2003 - Honolulu, United States
Duration: 5 Oct 20038 Oct 2003

Conference

ConferenceIEEE International Ultrasonics Symposium 2003
CountryUnited States
CityHonolulu
Period5/10/038/10/03

Fingerprint

transducers
ultrasonics
Lamb waves
proximity
vibration mode
composite materials

Keywords

  • analysis
  • spurious resonances
  • single
  • multi-element piezocompossite
  • ultrasonic transducers

Cite this

Reynolds, P., Hyslop, J. E., & Hayward, G. (2003). Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers. 1650-1653. Paper presented at IEEE International Ultrasonics Symposium 2003, Honolulu, United States. https://doi.org/10.1109/ULTSYM.2003.1293227
Reynolds, P. ; Hyslop, J.E. ; Hayward, G. / Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers. Paper presented at IEEE International Ultrasonics Symposium 2003, Honolulu, United States.3 p.
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Reynolds, P, Hyslop, JE & Hayward, G 2003, 'Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers' Paper presented at IEEE International Ultrasonics Symposium 2003, Honolulu, United States, 5/10/03 - 8/10/03, pp. 1650-1653. https://doi.org/10.1109/ULTSYM.2003.1293227

Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers. / Reynolds, P.; Hyslop, J.E.; Hayward, G.

2003. 1650-1653 Paper presented at IEEE International Ultrasonics Symposium 2003, Honolulu, United States.

Research output: Contribution to conferencePaper

TY - CONF

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AU - Hayward, G.

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N2 - 1-3 piezocomposites provide for significant advantages over solid piezoceramic transducers for ultrasound applications, at the expense of introduction of additional spurious resonances. We examine in detail the generation of high frequency inter-pillar (lateral) resonances in 1-3 piezoelectric composites, through experiment and finite element analysis (FEA) with the PZFlex package. These inter-pillar modes are clearly shown to be generated due to Lamb waves propagating through the substrate between pillars, the magnitude of which varies dependent upon magnitude of displacement from the thickness mode vibration and its proximity in the frequency domain.

AB - 1-3 piezocomposites provide for significant advantages over solid piezoceramic transducers for ultrasound applications, at the expense of introduction of additional spurious resonances. We examine in detail the generation of high frequency inter-pillar (lateral) resonances in 1-3 piezoelectric composites, through experiment and finite element analysis (FEA) with the PZFlex package. These inter-pillar modes are clearly shown to be generated due to Lamb waves propagating through the substrate between pillars, the magnitude of which varies dependent upon magnitude of displacement from the thickness mode vibration and its proximity in the frequency domain.

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Reynolds P, Hyslop JE, Hayward G. Analysis of spurious resonances in single and multi-element piezocomposite ultrasonic transducers. 2003. Paper presented at IEEE International Ultrasonics Symposium 2003, Honolulu, United States. https://doi.org/10.1109/ULTSYM.2003.1293227