Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Tatyana Konkova, Yiqing Ke, Sergey Mironov, Jin Onuki

Research output: Contribution to conferenceProceeding

Abstract

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

Conference

ConferenceAdvanced Metallization Conference 2012: 22nd Asian Session
CountryJapan
CityTokyo
Period22/10/1225/10/12

Fingerprint

Electron diffraction
Wire
Copper
Microstructure
Textures
Annealing
Electrons

Keywords

  • nanomaterials
  • grain boundaries
  • EBSD

Cite this

Konkova, T., Ke, Y., Mironov, S., & Onuki, J. (2012). Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. Advanced Metallization Conference 2012: 22nd Asian Session, Tokyo, Japan.
Konkova, Tatyana ; Ke, Yiqing ; Mironov, Sergey ; Onuki, Jin. / Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. Advanced Metallization Conference 2012: 22nd Asian Session, Tokyo, Japan.2 p.
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title = "Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method",
abstract = "The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.",
keywords = "nanomaterials, grain boundaries, EBSD",
author = "Tatyana Konkova and Yiqing Ke and Sergey Mironov and Jin Onuki",
year = "2012",
language = "English",
note = "Advanced Metallization Conference 2012: 22nd Asian Session ; Conference date: 22-10-2012 Through 25-10-2012",

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Konkova, T, Ke, Y, Mironov, S & Onuki, J 2012, 'Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method' Advanced Metallization Conference 2012: 22nd Asian Session, Tokyo, Japan, 22/10/12 - 25/10/12, .

Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. / Konkova, Tatyana; Ke, Yiqing; Mironov, Sergey; Onuki, Jin.

2012. Advanced Metallization Conference 2012: 22nd Asian Session, Tokyo, Japan.

Research output: Contribution to conferenceProceeding

TY - CONF

T1 - Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

AU - Konkova, Tatyana

AU - Ke, Yiqing

AU - Mironov, Sergey

AU - Onuki, Jin

PY - 2012

Y1 - 2012

N2 - The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

AB - The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

KW - nanomaterials

KW - grain boundaries

KW - EBSD

UR - http://www.admeta.org/2012/

M3 - Proceeding

ER -

Konkova T, Ke Y, Mironov S, Onuki J. Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. 2012. Advanced Metallization Conference 2012: 22nd Asian Session, Tokyo, Japan.