Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Tatyana Konkova; Yiqing Ke; Sergey Mironov; Jin Onuki

Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Tatyana Konkova, Yiqing Ke, Sergey Mironov, Jin Onuki

Design, Manufacturing And Engineering Management

Research output: Contribution to conference › Proceeding › peer-review

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Abstract

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

Original language	English
Number of pages	2
Publication status	Published - 2012
Event	Advanced Metallization Conference 2012: 22nd Asian Session - The University of Tokyo, Tokyo, Japan Duration: 22 Oct 2012 → 25 Oct 2012

Conference

Conference	Advanced Metallization Conference 2012: 22nd Asian Session
Country/Territory	Japan
City	Tokyo
Period	22/10/12 → 25/10/12

Keywords

nanomaterials
grain boundaries
EBSD

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Konkova-etal-ADMETA2012-analysis-of-electrodeposited-nano-scale-copper-wire-microstructure-EBSD-methodAccepted author manuscript, 622 KB

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title = "Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method",

abstract = "The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.",

keywords = "nanomaterials, grain boundaries, EBSD",

author = "Tatyana Konkova and Yiqing Ke and Sergey Mironov and Jin Onuki",

year = "2012",

language = "English",

note = "Advanced Metallization Conference 2012: 22nd Asian Session ; Conference date: 22-10-2012 Through 25-10-2012",

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TY - CONF

T1 - Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

AU - Konkova, Tatyana

AU - Ke, Yiqing

AU - Mironov, Sergey

AU - Onuki, Jin

PY - 2012

Y1 - 2012

N2 - The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

AB - The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

KW - nanomaterials

KW - grain boundaries

KW - EBSD

UR - http://www.admeta.org/2012/

M3 - Proceeding

T2 - Advanced Metallization Conference 2012: 22nd Asian Session

Y2 - 22 October 2012 through 25 October 2012

ER -

Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Abstract

Conference

Keywords

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