Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Tatyana Konkova, Yiqing Ke, Sergey Mironov, Jin Onuki

Research output: Contribution to conferenceProceeding

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Abstract

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.
Original languageEnglish
Number of pages2
Publication statusPublished - 2012
EventAdvanced Metallization Conference 2012: 22nd Asian Session - The University of Tokyo, Tokyo, Japan
Duration: 22 Oct 201225 Oct 2012

Conference

ConferenceAdvanced Metallization Conference 2012: 22nd Asian Session
CountryJapan
CityTokyo
Period22/10/1225/10/12

Keywords

  • nanomaterials
  • grain boundaries
  • EBSD

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