Abstract
The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.
Original language | English |
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Number of pages | 2 |
Publication status | Published - 2012 |
Event | Advanced Metallization Conference 2012: 22nd Asian Session - The University of Tokyo, Tokyo, Japan Duration: 22 Oct 2012 → 25 Oct 2012 |
Conference
Conference | Advanced Metallization Conference 2012: 22nd Asian Session |
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Country/Territory | Japan |
City | Tokyo |
Period | 22/10/12 → 25/10/12 |
Keywords
- nanomaterials
- grain boundaries
- EBSD