Abstract
A linear potential relaxation technique was used successfully to determine effective liquid-phase mass transfer boundary-layer thicknesses during active dissolution and cupric sulfate salt film thicknesses during passive etching for a copper rotating disk electrode immersed in a CuSO4-H2SO4 electrolyte. Experimentally measured concentration over-potentials immediately after current interruption were found to decay linearly with the square-root of time. A theoretical model was derived to calculate liquid-phase effective mass transfer boundary-layer thicknesses or salt film thicknesses from the slope and intercept of the linear potential decay regime. For active copper dissolution, effective mass transfer boundary layer thicknesses were ≈ 56% smaller than those for cathodic deposition. The effective mass transfer boundary-layer thickness were used to accurately predict the critical current density for prepassive CuSO4 salt film formation. Experimentally determined salt films ranged in thickness from 9.2 × 10-4 to 3.2 × 10-3 cm, depending on the anode potential, the passivation time, and the disk rotation speed. Steady-state film thicknesses were dependent on the 1/3 power of the applied potential and were inversely proportional to the disk rotation speed raised to the 1/3 power.
Original language | English |
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Pages (from-to) | 2502-2509 |
Number of pages | 8 |
Journal | Journal of the Electrochemical Society |
Volume | 137 |
Issue number | 8 |
DOIs | |
Publication status | Published - Aug 1990 |
Keywords
- copper dissolution
- convective mass transfer