An open letter to members of the ieee dielectrics and electrical insulation society

Len Dissado; Christian Laurent; Gian Carlo Montanari; Noriyuki Shimizu; John Fothergill; Paul Lewin; Yasuo Sekii; Tony  Fouracre

doi:10.1109/MEI.2008.4635654

An open letter to members of the ieee dielectrics and electrical insulation society

Len Dissado, Christian Laurent, Gian Carlo Montanari, Noriyuki Shimizu, John Fothergill, Paul Lewin, Yasuo Sekii, Tony Fouracre

Electronic And Electrical Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.

Original language	English
Pages (from-to)	4-4
Number of pages	1
Journal	IEEE Electrical Insulation Magazine
Volume	24
Issue number	5
DOIs	https://doi.org/10.1109/MEI.2008.4635654
Publication status	Published - Sept 2008

Keywords

electrical insulation
IEEE dielectrics
electrical insulation society

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10.1109/MEI.2008.4635654

Cite this

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title = "An open letter to members of the ieee dielectrics and electrical insulation society",

abstract = "We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.",

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AU - Laurent, Christian

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AU - Shimizu, Noriyuki

AU - Fothergill, John

AU - Lewin, Paul

AU - Sekii, Yasuo

AU - Fouracre, Tony

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N2 - We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.

AB - We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.

KW - electrical insulation

KW - IEEE dielectrics

KW - electrical insulation society

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An open letter to members of the ieee dielectrics and electrical insulation society

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Keywords

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