An open letter to members of the ieee dielectrics and electrical insulation society

Len Dissado, Christian Laurent, Gian Carlo Montanari, Noriyuki Shimizu, John Fothergill, Paul Lewin, Yasuo Sekii, Tony Fouracre

Research output: Contribution to journalArticlepeer-review


We, the undersigned, wish to express our concerns about the future of the CEIDP(Conference on Electrical Insulation andDielectric Phenomena), an important annual event in the calendar of the DEIS. Over many years, CEIDP has provided a valuable conference for our community. At present, many academic institutions encourage their staff to publish widely, and we believe there is a general needfor a strong quality assessment procedure for all the IEEE-sponsored conferences. However, we feel that the CEIDP Executive has not been responsive to suggestions for improvement in recent years and, as a result, the future of the conference is under threat. We therefore felt it necessary to write this open letter to which we would hope the DEIS membership would give support.
Original languageEnglish
Pages (from-to)4-4
Number of pages1
JournalIEEE Electrical Insulation Magazine
Issue number5
Publication statusPublished - Sept 2008


  • electrical insulation
  • IEEE dielectrics
  • electrical insulation society


Dive into the research topics of 'An open letter to members of the ieee dielectrics and electrical insulation society'. Together they form a unique fingerprint.

Cite this