An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon

C. S. Leo; Sum Huan Ng; D. L. Butler; Steven Danyluk

An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon

C. S. Leo, Sum Huan Ng, D. L. Butler, Steven Danyluk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

Abstract

In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres

Original language	English
Title of host publication	Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
Place of Publication	Warrendale, Pa
Pages	141-146
Number of pages	6
Volume	1249
Publication status	Published - 5 Oct 2010
Externally published	Yes
Event	2010 MRS Spring Meeting - San Francisco, CA, United States Duration: 5 Apr 2010 → 9 Apr 2010

Conference

Conference	2010 MRS Spring Meeting
Country/Territory	United States
City	San Francisco, CA
Period	5/04/10 → 9/04/10

Keywords

planarization techniques
electrokinetics
micromachining

Cite this

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title = "An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon",

abstract = "In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres ",

keywords = "planarization techniques, electrokinetics, micromachining",

author = "Leo, {C. S.} and Ng, {Sum Huan} and Butler, {D. L.} and Steven Danyluk",

year = "2010",

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day = "5",

language = "English",

isbn = "9781605112268",

volume = "1249",

pages = "141--146",

booktitle = "Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics",

note = "2010 MRS Spring Meeting ; Conference date: 05-04-2010 Through 09-04-2010",

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An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon. / Leo, C. S.; Ng, Sum Huan; Butler, D. L. et al.
Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics. Vol. 1249 Warrendale, Pa, 2010. p. 141-146.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

TY - GEN

T1 - An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon

AU - Leo, C. S.

AU - Ng, Sum Huan

AU - Butler, D. L.

AU - Danyluk, Steven

PY - 2010/10/5

Y1 - 2010/10/5

N2 - In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres

AB - In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres

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KW - electrokinetics

KW - micromachining

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SN - 9781605112268

VL - 1249

SP - 141

EP - 146

BT - Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

CY - Warrendale, Pa

T2 - 2010 MRS Spring Meeting

Y2 - 5 April 2010 through 9 April 2010

ER -

An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon

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Keywords

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