An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon

C. S. Leo, Sum Huan Ng, D. L. Butler, Steven Danyluk

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres

Original languageEnglish
Title of host publicationAdvanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
Place of PublicationWarrendale, Pa
Pages141-146
Number of pages6
Volume1249
Publication statusPublished - 5 Oct 2010
Externally publishedYes
Event2010 MRS Spring Meeting - San Francisco, CA, United States
Duration: 5 Apr 20109 Apr 2010

Conference

Conference2010 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period5/04/109/04/10

Keywords

  • planarization techniques
  • electrokinetics
  • micromachining

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