Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

Benoit Guilhabert; Sean P. Bommer; Nils K. Wessling; Dimitars Jevtics; Jack A. Smith; Zhongyi Xia; Saptarsi Ghosh; Menno Kappers; Ian M. Watson; Rachel A. Oliver; Martin D. Dawson; Michael J. Strain

doi:10.1109/jstqe.2022.3227340

Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

Benoit Guilhabert, Sean P. Bommer, Nils K. Wessling, Dimitars Jevtics, Jack A. Smith, Zhongyi Xia, Saptarsi Ghosh, Menno Kappers, Ian M. Watson, Rachel A. Oliver, Martin D. Dawson, Michael J. Strain

Research output: Contribution to journal › Article › peer-review

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Abstract

Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.

Original language	English
Article number	7900111
Pages (from-to)	1-11
Number of pages	12
Journal	IEEE Journal of Selected Topics in Quantum Electronics
Volume	29
Issue number	3
Early online date	7 Dec 2022
DOIs	https://doi.org/10.1109/jstqe.2022.3227340
Publication status	Published - 30 Jun 2023

Keywords

integrated optics
optical waveguide components
hybrid integrated circuits
semiconductor device fabrication
transfer printing
photonic integrated circuits
photonic integration

Access to Document

10.1109/jstqe.2022.3227340

Guilhabert-etal-JSTQE-2022-Advanced-transfer-printing-with-in-situ-optical-monitoring-for-the-integrationAccepted author manuscript, 7.35 MBLicence: Strath_1

A packaged source of multiplexed entangled photons
Caspani, L. (Principal Investigator) & Strain, M. (Co-investigator)
Innovate UK
1/11/22 → 30/04/25
Project: Research
Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)
Strain, M. (Principal Investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/12/20 → 31/05/24
Project: Research
'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
Dawson, M. (Principal Investigator), Martin, R. (Co-investigator), Strain, M. (Co-investigator), Watson, I. (Co-investigator) & Guilhabert, B. J. E. (Research Co-investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/06/18 → 31/05/24
Project: Research

Cite this

Guilhabert, B., Bommer, S. P., Wessling, N. K., Jevtics, D., Smith, J. A., Xia, Z., Ghosh, S., Kappers, M., Watson, I. M., Oliver, R. A., Dawson, M. D., & Strain, M. J. (2023). Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices. IEEE Journal of Selected Topics in Quantum Electronics, 29(3), 1-11. Article 7900111. https://doi.org/10.1109/jstqe.2022.3227340

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title = "Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices",

abstract = "Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.",

keywords = "integrated optics, optical waveguide components, hybrid integrated circuits, semiconductor device fabrication, transfer printing, photonic integrated circuits, photonic integration",

author = "Benoit Guilhabert and Bommer, {Sean P.} and Wessling, {Nils K.} and Dimitars Jevtics and Smith, {Jack A.} and Zhongyi Xia and Saptarsi Ghosh and Menno Kappers and Watson, {Ian M.} and Oliver, {Rachel A.} and Dawson, {Martin D.} and Strain, {Michael J.}",

note = "{\textcopyright} 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.",

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day = "30",

doi = "10.1109/jstqe.2022.3227340",

language = "English",

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Guilhabert, B , Bommer, SP, Wessling, NK, Jevtics, D , Smith, JA , Xia, Z, Ghosh, S, Kappers, M, Watson, IM, Oliver, RA, Dawson, MD & Strain, MJ 2023, 'Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices', IEEE Journal of Selected Topics in Quantum Electronics, vol. 29, no. 3, 7900111, pp. 1-11. https://doi.org/10.1109/jstqe.2022.3227340

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AU - Guilhabert, Benoit

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AU - Wessling, Nils K.

AU - Jevtics, Dimitars

AU - Smith, Jack A.

AU - Xia, Zhongyi

AU - Ghosh, Saptarsi

AU - Kappers, Menno

AU - Watson, Ian M.

AU - Oliver, Rachel A.

AU - Dawson, Martin D.

AU - Strain, Michael J.

N1 - © 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2023/6/30

Y1 - 2023/6/30

N2 - Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.

AB - Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.

KW - integrated optics

KW - optical waveguide components

KW - hybrid integrated circuits

KW - semiconductor device fabrication

KW - transfer printing

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JF - IEEE Journal of Selected Topics in Quantum Electronics

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M1 - 7900111

ER -

Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

Abstract

Keywords

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Projects

A packaged source of multiplexed entangled photons

Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)

'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing

Cite this