Projects per year
Abstract
Original language | English |
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Article number | 7900111 |
Pages (from-to) | 1-11 |
Number of pages | 12 |
Journal | IEEE Journal of Selected Topics in Quantum Electronics |
Volume | 29 |
Issue number | 3 |
Early online date | 7 Dec 2022 |
DOIs | |
Publication status | Published - 30 Jun 2023 |
Keywords
- integrated optics
- optical waveguide components
- hybrid integrated circuits
- semiconductor device fabrication
- transfer printing
- photonic integrated circuits
- photonic integration
Fingerprint
Dive into the research topics of 'Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices'. Together they form a unique fingerprint.Projects
- 4 Finished
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A packaged source of multiplexed entangled photons
Caspani, L. (Principal Investigator) & Strain, M. (Co-investigator)
1/11/22 → 30/04/25
Project: Research
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Zero-change manufacturing of photonic interconnects for silicon electronics (IntraChip)
Strain, M. (Principal Investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/12/20 → 31/05/24
Project: Research
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'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
Dawson, M. (Principal Investigator), Martin, R. (Co-investigator), Strain, M. (Co-investigator), Watson, I. (Co-investigator) & Guilhabert, B. J. E. (Research Co-investigator)
EPSRC (Engineering and Physical Sciences Research Council)
1/06/18 → 31/05/24
Project: Research