Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

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    Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.
    Original languageEnglish
    Article number7900111
    Pages (from-to)1-11
    Number of pages12
    JournalIEEE Journal of Selected Topics in Quantum Electronics
    Issue number3
    Early online date7 Dec 2022
    Publication statusPublished - 30 Jun 2023


    • integrated optics
    • optical waveguide components
    • hybrid integrated circuits
    • semiconductor device fabrication
    • transfer printing
    • photonic integrated circuits
    • photonic integration


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