Advanced transfer printing with in-situ optical monitoring for the integration of micron-scale devices

Benoit Guilhabert, Sean P. Bommer, Nils K. Wessling, Dimitars Jevtics, Jack A. Smith, Zhongyi Xia, Saptarsi Ghosh, Menno Kappers, Ian M. Watson, Rachel A. Oliver, Martin D. Dawson, Michael J. Strain

    Research output: Contribution to journalArticlepeer-review

    5 Citations (Scopus)
    87 Downloads (Pure)

    Abstract

    Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.
    Original languageEnglish
    Article number7900111
    Pages (from-to)1-11
    Number of pages12
    JournalIEEE Journal of Selected Topics in Quantum Electronics
    Volume29
    Issue number3
    Early online date7 Dec 2022
    DOIs
    Publication statusPublished - 30 Jun 2023

    Keywords

    • integrated optics
    • optical waveguide components
    • hybrid integrated circuits
    • semiconductor device fabrication
    • transfer printing
    • photonic integrated circuits
    • photonic integration

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