A wideband annular piezoelectric composite transducer configuration with a graded active layer profile

S.N. Ramadas, R.L. O'Leary, A. Gachagan, G. Hayward, R.A. Banks

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

10 Citations (Scopus)

Abstract

Ultrasound technology is routinely used in many application areas including underwater sonar, biomedicine, non destructive evaluation (NDE), materials characterisation and process control - all with direct routes into the vital economic sectors of energy, transportation, healthcare and food and drink. As technology demands have increased, device manufacturers are faced with a constant need to extend bandwidth and/or frequency response, while at the same time improve sensitivity, all combined with minimisation of size, complexity and cost. It is becoming increasingly apparent that the current transducer technology, with its emphasis on multi-element array systems, is nearing saturation and new approaches to ultrasonic system design and operation are needed to satisfy many future demands. This paper presents wideband annular piezoelectric configuration with graded composite active layer.
Original languageEnglish
Title of host publicationProceedings of the 2009 IEEE International Ultrasonics Symposium (IUS)
PublisherIEEE
Pages2742-2745
Number of pages4
ISBN (Print)9781424443895
DOIs
Publication statusPublished - Jan 2010
Event2009 IEEE Ultrasonics Symposium - Rome, Italy
Duration: 20 Sep 200923 Sep 2009

Conference

Conference2009 IEEE Ultrasonics Symposium
CountryItaly
CityRome
Period20/09/0923/09/09

Keywords

  • ultrasonic transducer arrays
  • wideband piezoelectric composite transducer configuration
  • sonar applications
  • composite transducer configuration
  • graded active layer profile

Projects

  • Cite this

    Ramadas, S. N., O'Leary, R. L., Gachagan, A., Hayward, G., & Banks, R. A. (2010). A wideband annular piezoelectric composite transducer configuration with a graded active layer profile. In Proceedings of the 2009 IEEE International Ultrasonics Symposium (IUS) (pp. 2742-2745). IEEE. https://doi.org/10.1109/ULTSYM.2009.5441479