In this study, a novel wetness and moisture concentration analysis approach is presented. Finite Element Method is utilised for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element based solutions and newly introduced peridynamics theory. For numerical analysis, reflow soldering stage is simulated for a multi-material system having time dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is much general than some other existing models which are limited to certain conditions.
- finite element