A novel moisture diffusion modeling approach using finite element analysis

Cagan Diyaroglu, Erdogan Madenci, Selda Oterkus, Erkan Oterkus

Research output: Contribution to journalArticle

Abstract

In this study, a novel wetness and moisture concentration analysis approach is presented. Finite Element Method is utilised for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element based solutions and newly introduced peridynamics theory. For numerical analysis, reflow soldering stage is simulated for a multi-material system having time dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is much general than some other existing models which are limited to certain conditions.
LanguageEnglish
Article number438
Number of pages20
JournalElectronics
Volume7
Issue number12
DOIs
Publication statusPublished - 14 Dec 2018

Fingerprint

Moisture
Finite element method
Soldering
Numerical analysis
Solubility
Activation energy
Temperature
Hot Temperature

Keywords

  • moisture
  • diffusion
  • finite element
  • wetness
  • concentration

Cite this

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title = "A novel moisture diffusion modeling approach using finite element analysis",
abstract = "In this study, a novel wetness and moisture concentration analysis approach is presented. Finite Element Method is utilised for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element based solutions and newly introduced peridynamics theory. For numerical analysis, reflow soldering stage is simulated for a multi-material system having time dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is much general than some other existing models which are limited to certain conditions.",
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A novel moisture diffusion modeling approach using finite element analysis. / Diyaroglu, Cagan ; Madenci, Erdogan; Oterkus, Selda; Oterkus, Erkan.

In: Electronics, Vol. 7, No. 12, 438, 14.12.2018.

Research output: Contribution to journalArticle

TY - JOUR

T1 - A novel moisture diffusion modeling approach using finite element analysis

AU - Diyaroglu, Cagan

AU - Madenci, Erdogan

AU - Oterkus, Selda

AU - Oterkus, Erkan

PY - 2018/12/14

Y1 - 2018/12/14

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AB - In this study, a novel wetness and moisture concentration analysis approach is presented. Finite Element Method is utilised for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element based solutions and newly introduced peridynamics theory. For numerical analysis, reflow soldering stage is simulated for a multi-material system having time dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is much general than some other existing models which are limited to certain conditions.

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KW - diffusion

KW - finite element

KW - wetness

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