Abstract
| Language | English |
|---|---|
| Title of host publication | Proceedings, IEEE 68th Electronic Components and Technology Conference |
| Place of Publication | Piscataway, NJ |
| Publisher | IEEE |
| Pages | 227-235 |
| Number of pages | 9 |
| ISBN (Electronic) | 9781538649992 |
| DOIs | |
| Publication status | Published - 9 Aug 2018 |
| Event | 2018 IEEE 68th Electronic Components and Technology Conference - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018 |
Conference
| Conference | 2018 IEEE 68th Electronic Components and Technology Conference |
|---|---|
| Abbreviated title | ECTC |
| Country | United States |
| City | San Diego |
| Period | 29/05/18 → 1/06/18 |
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Keywords
- finite element analysis
- moisture
- conductivity
- heating systems
- mathematical model
- temperature dependence
- thermal analysis
Cite this
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A novel finite element technique for moisture diffusion modeling using ANSYS. / Diyaroglu, C.; Madenci, E.; Oterkus, S.; Oterkus, E.
Proceedings, IEEE 68th Electronic Components and Technology Conference. Piscataway, NJ : IEEE, 2018. p. 227-235.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book
TY - GEN
T1 - A novel finite element technique for moisture diffusion modeling using ANSYS
AU - Diyaroglu, C.
AU - Madenci, E.
AU - Oterkus, S.
AU - Oterkus, E.
N1 - © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
PY - 2018/8/9
Y1 - 2018/8/9
N2 - This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.
AB - This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.
KW - finite element analysis
KW - moisture
KW - conductivity
KW - heating systems
KW - mathematical model
KW - temperature dependence
KW - thermal analysis
UR - https://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=8415930
U2 - 10.1109/ECTC.2018.00043
DO - 10.1109/ECTC.2018.00043
M3 - Conference contribution book
SP - 227
EP - 235
BT - Proceedings, IEEE 68th Electronic Components and Technology Conference
PB - IEEE
CY - Piscataway, NJ
ER -