A novel finite element technique for moisture diffusion modeling using ANSYS

C. Diyaroglu, E. Madenci, S. Oterkus, E. Oterkus

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

2 Citations (Scopus)

Abstract

This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.
LanguageEnglish
Title of host publicationProceedings, IEEE 68th Electronic Components and Technology Conference
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages227-235
Number of pages9
ISBN (Electronic)9781538649992
DOIs
Publication statusPublished - 9 Aug 2018
Event2018 IEEE 68th Electronic Components and Technology Conference - San Diego, United States
Duration: 29 May 20181 Jun 2018

Conference

Conference2018 IEEE 68th Electronic Components and Technology Conference
Abbreviated titleECTC
CountryUnited States
CitySan Diego
Period29/05/181/06/18

Fingerprint

Moisture
Solubility
Activation energy
Temperature
Desorption

Keywords

  • finite element analysis
  • moisture
  • conductivity
  • heating systems
  • mathematical model
  • temperature dependence
  • thermal analysis

Cite this

Diyaroglu, C., Madenci, E., Oterkus, S., & Oterkus, E. (2018). A novel finite element technique for moisture diffusion modeling using ANSYS. In Proceedings, IEEE 68th Electronic Components and Technology Conference (pp. 227-235). Piscataway, NJ: IEEE. https://doi.org/10.1109/ECTC.2018.00043
Diyaroglu, C. ; Madenci, E. ; Oterkus, S. ; Oterkus, E. / A novel finite element technique for moisture diffusion modeling using ANSYS. Proceedings, IEEE 68th Electronic Components and Technology Conference. Piscataway, NJ : IEEE, 2018. pp. 227-235
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Diyaroglu, C, Madenci, E, Oterkus, S & Oterkus, E 2018, A novel finite element technique for moisture diffusion modeling using ANSYS. in Proceedings, IEEE 68th Electronic Components and Technology Conference. IEEE, Piscataway, NJ, pp. 227-235, 2018 IEEE 68th Electronic Components and Technology Conference , San Diego, United States, 29/05/18. https://doi.org/10.1109/ECTC.2018.00043

A novel finite element technique for moisture diffusion modeling using ANSYS. / Diyaroglu, C.; Madenci, E.; Oterkus, S.; Oterkus, E.

Proceedings, IEEE 68th Electronic Components and Technology Conference. Piscataway, NJ : IEEE, 2018. p. 227-235.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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Diyaroglu C, Madenci E, Oterkus S, Oterkus E. A novel finite element technique for moisture diffusion modeling using ANSYS. In Proceedings, IEEE 68th Electronic Components and Technology Conference. Piscataway, NJ: IEEE. 2018. p. 227-235 https://doi.org/10.1109/ECTC.2018.00043