A novel finite element technique for moisture diffusion modeling using ANSYS

C. Diyaroglu; E. Madenci; S. Oterkus; E. Oterkus

doi:10.1109/ECTC.2018.00043

A novel finite element technique for moisture diffusion modeling using ANSYS

C. Diyaroglu, E. Madenci, S. Oterkus, E. Oterkus

Naval Architecture, Ocean And Marine Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

2 Citations (Scopus)

29 Downloads (Pure)

Abstract

This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.

Original language	English
Title of host publication	Proceedings, IEEE 68th Electronic Components and Technology Conference
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	227-235
Number of pages	9
ISBN (Electronic)	9781538649992
DOIs	https://doi.org/10.1109/ECTC.2018.00043
Publication status	Published - 9 Aug 2018
Event	2018 IEEE 68th Electronic Components and Technology Conference - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018

Conference

Conference	2018 IEEE 68th Electronic Components and Technology Conference
Abbreviated title	ECTC
Country	United States
City	San Diego
Period	29/05/18 → 1/06/18

Keywords

finite element analysis
moisture
conductivity
heating systems
mathematical model
temperature dependence
thermal analysis

Access to Document

10.1109/ECTC.2018.00043

Diyaroglu-etal-ECTC2018-A-novel-finite-element-technique-for-moisture-diffusionAccepted author manuscript, 540 KB

https://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=8415930

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Diyaroglu, C., Madenci, E., Oterkus, S., & Oterkus, E. (2018). A novel finite element technique for moisture diffusion modeling using ANSYS. In Proceedings, IEEE 68th Electronic Components and Technology Conference (pp. 227-235). IEEE. https://doi.org/10.1109/ECTC.2018.00043

@inproceedings{7f823401afa7475790d52a59d339fcff,

title = "A novel finite element technique for moisture diffusion modeling using ANSYS",

abstract = "This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS {"}diffusion{"} and {"}coupled field{"} elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS {"}coupled field{"} elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS {"}diffusion{"} element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.",

keywords = "finite element analysis, moisture, conductivity, heating systems, mathematical model, temperature dependence, thermal analysis",

author = "C. Diyaroglu and E. Madenci and S. Oterkus and E. Oterkus",

note = "{\textcopyright} 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.; 2018 IEEE 68th Electronic Components and Technology Conference , ECTC ; Conference date: 29-05-2018 Through 01-06-2018",

year = "2018",

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doi = "10.1109/ECTC.2018.00043",

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booktitle = "Proceedings, IEEE 68th Electronic Components and Technology Conference",

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Diyaroglu, C, Madenci, E, Oterkus, S & Oterkus, E 2018, A novel finite element technique for moisture diffusion modeling using ANSYS. in Proceedings, IEEE 68th Electronic Components and Technology Conference. IEEE, Piscataway, NJ, pp. 227-235, 2018 IEEE 68th Electronic Components and Technology Conference , San Diego, United States, 29/05/18. https://doi.org/10.1109/ECTC.2018.00043

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AU - Madenci, E.

AU - Oterkus, S.

AU - Oterkus, E.

N1 - © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2018/8/9

Y1 - 2018/8/9

N2 - This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.

AB - This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.

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KW - moisture

KW - conductivity

KW - heating systems

KW - mathematical model

KW - temperature dependence

KW - thermal analysis

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