Abstract
| Language | English |
|---|---|
| Pages | 85-88 |
| Number of pages | 4 |
| Journal | Scripta Materialia |
| Volume | 99 |
| Early online date | 18 Dec 2014 |
| DOIs | |
| Publication status | Published - 1 Apr 2015 |
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Keywords
- electric-field-activated sintering
- micro-fast technology
- copper powder
- grain joining
- grain refinement
Cite this
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A new densification mechanism of copper powder sintered under an electrical field. / Huang, Kunlan; Yang, Yi ; Qin, Yi; Yang, Gang; Yin, Deqiang.
In: Scripta Materialia, Vol. 99, 01.04.2015, p. 85-88.Research output: Contribution to journal › Article
TY - JOUR
T1 - A new densification mechanism of copper powder sintered under an electrical field
AU - Huang, Kunlan
AU - Yang, Yi
AU - Qin, Yi
AU - Yang, Gang
AU - Yin, Deqiang
PY - 2015/4/1
Y1 - 2015/4/1
N2 - A new sintering mechanism is revealed for copper powder sintered under the influence of an electrical field and a force field during the formation of microcomponents. Analysis of the microstructure and grain boundary evolution of the sintered samples showed that the disappearance of the interface at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative microsintering process. The densification process is therefore different from what is known in a conventional powder sintering process.
AB - A new sintering mechanism is revealed for copper powder sintered under the influence of an electrical field and a force field during the formation of microcomponents. Analysis of the microstructure and grain boundary evolution of the sintered samples showed that the disappearance of the interface at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative microsintering process. The densification process is therefore different from what is known in a conventional powder sintering process.
KW - electric-field-activated sintering
KW - micro-fast technology
KW - copper powder
KW - grain joining
KW - grain refinement
UR - http://www.sciencedirect.com/science/article/pii/S1359646214005077
UR - http://www.sciencedirect.com/science/journal/13596462
U2 - 10.1016/j.scriptamat.2014.12.002
DO - 10.1016/j.scriptamat.2014.12.002
M3 - Article
VL - 99
SP - 85
EP - 88
JO - Scripta Materialia
T2 - Scripta Materialia
JF - Scripta Materialia
SN - 1359-6462
ER -