A new densification mechanism of copper powder sintered under an electrical field

Kunlan Huang, Yi Yang, Yi Qin, Gang Yang, Deqiang Yin

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

A new sintering mechanism is revealed for copper powder sintered under the influence of an electrical field and a force field during the formation of microcomponents. Analysis of the microstructure and grain boundary evolution of the sintered samples showed that the disappearance of the interface at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative microsintering process. The densification process is therefore different from what is known in a conventional powder sintering process.
LanguageEnglish
Pages85-88
Number of pages4
JournalScripta Materialia
Volume99
Early online date18 Dec 2014
DOIs
Publication statusPublished - 1 Apr 2015

Fingerprint

Copper powder
densification
Densification
sintering
Sintering
grain formation
copper
Grain refinement
Powders
field theory (physics)
Grain boundaries
grain boundaries
microstructure
Microstructure

Keywords

  • electric-field-activated sintering
  • micro-fast technology
  • copper powder
  • grain joining
  • grain refinement

Cite this

Huang, Kunlan ; Yang, Yi ; Qin, Yi ; Yang, Gang ; Yin, Deqiang. / A new densification mechanism of copper powder sintered under an electrical field. In: Scripta Materialia. 2015 ; Vol. 99. pp. 85-88.
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A new densification mechanism of copper powder sintered under an electrical field. / Huang, Kunlan; Yang, Yi ; Qin, Yi; Yang, Gang; Yin, Deqiang.

In: Scripta Materialia, Vol. 99, 01.04.2015, p. 85-88.

Research output: Contribution to journalArticle

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