A method for pattern metallization of substrates

C Forbes (Inventor), A. Gelbman (Inventor), C. Turner (Inventor), H. Gleskova (Inventor), S. Wagner (Inventor)

Research output: Patent


The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
Original languageEnglish
Patent numberUS2005263903
Publication statusPublished - 1 Dec 2005


  • adhesion layer
  • substrate
  • electrically conductive properties
  • electrophotographic imaging compound
  • pattern metallization
  • lamination properties
  • electronic circuit
  • flexible polymeric substrates
  • rigid polymeric substrates


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