TY - PAT
T1 - A method for pattern metallization of substrates
AU - Forbes, C
AU - Gelbman, A.
AU - Turner, C.
AU - Gleskova, H.
AU - Wagner, S.
N1 - WO2006094040
PY - 2005/12/1
Y1 - 2005/12/1
N2 - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
AB - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
KW - adhesion layer
KW - substrate
KW - electrically conductive properties
KW - electrophotographic imaging compound
KW - pattern metallization
KW - lamination properties
KW - electronic circuit
KW - flexible polymeric substrates
KW - rigid polymeric substrates
UR - http://www.patentlens.net/patentlens/patents.html?patnums=US_2005_0263903_A1&language=en&query=((A%20method%20for%20pattern%20metallization%20of%20substrates)%20in%20title)&stemming=true&returnTo=structured.html%3Fquery%3D%2528%2528A%2Bmethod%2Bfor%2Bpattern%2Bmetallization%2Bof%2Bsubstrates%2529%2Bin%2Btitle%2529%26stemming%3Dtrue%26collections%3DUS_B%2CEP_B%2CAU_B%2CUS_A%2CWO_A%2CAU_A%26language%3Den%26pageLength%3D10%26fields%3Dtitle%2Ctitle%2Cabstract%2Cinventor%2Capplicant
UR - http://www.patentlens.net/patentlens/patents.html?patnums=WO_2006_094040_A2&language=en&query=((A%20method%20for%20pattern%20metallization%20of%20substrates)%20in%20title)&stemming=true&returnTo=structured.html%3Fquery%3D%2528%2528A%2Bmethod%2Bfor%2Bpattern%2Bmetallization%2Bof%2Bsubstrates%2529%2Bin%2Btitle%2529%26stemming%3Dtrue%26collections%3DUS_B%2CEP_B%2CAU_B%2CUS_A%2CWO_A%2CAU_A%26language%3Den%26pageLength%3D10%26fields%3Dtitle%2Ctitle%2Cabstract%2Cinventor%2Capplicant
M3 - Patent
M1 - US2005263903
ER -