A method for pattern metallization of substrates

C Forbes (Inventor), A. Gelbman (Inventor), C. Turner (Inventor), H. Gleskova (Inventor), S. Wagner (Inventor)

Research output: Patent

Abstract

The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
LanguageEnglish
Patent numberUS2005263903
IPCH01L021/00
Publication statusPublished - 1 Dec 2005

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Metallizing
Patents and inventions
Substrates
Adhesion
Masks
Imaging techniques
Networks (circuits)

Keywords

  • adhesion layer
  • substrate
  • electrically conductive properties
  • electrophotographic imaging compound
  • pattern metallization
  • lamination properties
  • electronic circuit
  • flexible polymeric substrates
  • rigid polymeric substrates

Cite this

Forbes, C., Gelbman, A., Turner, C., Gleskova, H., & Wagner, S. (2005). IPC No. H01L021/00. A method for pattern metallization of substrates. (Patent No. US2005263903).
Forbes, C (Inventor) ; Gelbman, A. (Inventor) ; Turner, C. (Inventor) ; Gleskova, H. (Inventor) ; Wagner, S. (Inventor). / A method for pattern metallization of substrates. IPC No.: H01L021/00. Patent No.: US2005263903.
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author = "C Forbes and A. Gelbman and C. Turner and H. Gleskova and S. Wagner",
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Forbes, C, Gelbman, A, Turner, C, Gleskova, H & Wagner, S 2005, A method for pattern metallization of substrates, Patent No. US2005263903, IPC No. H01L021/00.

A method for pattern metallization of substrates. / Forbes, C (Inventor); Gelbman, A. (Inventor); Turner, C. (Inventor); Gleskova, H. (Inventor); Wagner, S. (Inventor).

IPC No.: H01L021/00. Patent No.: US2005263903.

Research output: Patent

TY - PAT

T1 - A method for pattern metallization of substrates

AU - Forbes, C

AU - Gelbman, A.

AU - Turner, C.

AU - Gleskova, H.

AU - Wagner, S.

N1 - WO2006094040

PY - 2005/12/1

Y1 - 2005/12/1

N2 - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

AB - The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

KW - adhesion layer

KW - substrate

KW - electrically conductive properties

KW - electrophotographic imaging compound

KW - pattern metallization

KW - lamination properties

KW - electronic circuit

KW - flexible polymeric substrates

KW - rigid polymeric substrates

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Forbes C, Gelbman A, Turner C, Gleskova H, Wagner S, inventors. A method for pattern metallization of substrates. H01L021/00. 2005 Dec 1.