A low cost patternable packaging technology for biosensors

Anthony Buchoux, Ewen O. Blair, Andreas Tsiamis, Jamie R.K. Marland, Stewart Smith

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

1 Citation (Scopus)

Abstract

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

LanguageEnglish
Title of host publication2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
EditorsBenoit Charlot, Yoshio Mita, Pascal Nouet, Claude Pellet, Francis Pressecq, Peter Schneider, Stewart Smith
Place of PublicationPiscataway, NJ
PublisherIEEE
Number of pages6
ISBN (Print)9781538629529
DOIs
Publication statusPublished - 20 Jul 2017
Event19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 - Bordeaux, France
Duration: 29 May 20171 Jun 2017

Conference

Conference19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
CountryFrance
CityBordeaux
Period29/05/171/06/17

Fingerprint

Biosensors
Packaging
Packaging materials
Microchannels
Microfluidics
Curing
Costs
Experiments

Keywords

  • biosensors
  • electrochemistry
  • packaging

Cite this

Buchoux, A., Blair, E. O., Tsiamis, A., Marland, J. R. K., & Smith, S. (2017). A low cost patternable packaging technology for biosensors. In B. Charlot, Y. Mita, P. Nouet, C. Pellet, F. Pressecq, P. Schneider, & S. Smith (Eds.), 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 [7984493] Piscataway, NJ: IEEE. https://doi.org/10.1109/DTIP.2017.7984493
Buchoux, Anthony ; Blair, Ewen O. ; Tsiamis, Andreas ; Marland, Jamie R.K. ; Smith, Stewart. / A low cost patternable packaging technology for biosensors. 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. editor / Benoit Charlot ; Yoshio Mita ; Pascal Nouet ; Claude Pellet ; Francis Pressecq ; Peter Schneider ; Stewart Smith. Piscataway, NJ : IEEE, 2017.
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Buchoux, A, Blair, EO, Tsiamis, A, Marland, JRK & Smith, S 2017, A low cost patternable packaging technology for biosensors. in B Charlot, Y Mita, P Nouet, C Pellet, F Pressecq, P Schneider & S Smith (eds), 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017., 7984493, IEEE, Piscataway, NJ, 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 29/05/17. https://doi.org/10.1109/DTIP.2017.7984493

A low cost patternable packaging technology for biosensors. / Buchoux, Anthony; Blair, Ewen O.; Tsiamis, Andreas; Marland, Jamie R.K.; Smith, Stewart.

2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. ed. / Benoit Charlot; Yoshio Mita; Pascal Nouet; Claude Pellet; Francis Pressecq; Peter Schneider; Stewart Smith. Piscataway, NJ : IEEE, 2017. 7984493.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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Buchoux A, Blair EO, Tsiamis A, Marland JRK, Smith S. A low cost patternable packaging technology for biosensors. In Charlot B, Mita Y, Nouet P, Pellet C, Pressecq F, Schneider P, Smith S, editors, 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Piscataway, NJ: IEEE. 2017. 7984493 https://doi.org/10.1109/DTIP.2017.7984493