A low cost patternable packaging technology for biosensors

Anthony Buchoux; Ewen O. Blair; Andreas Tsiamis; Jamie R.K. Marland; Stewart Smith

doi:10.1109/DTIP.2017.7984493

A low cost patternable packaging technology for biosensors

Anthony Buchoux, Ewen O. Blair, Andreas Tsiamis, Jamie R.K. Marland, Stewart Smith

Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

1 Citation (Scopus)

20 Downloads (Pure)

Abstract

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

Original language	English
Title of host publication	2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
Editors	Benoit Charlot, Yoshio Mita, Pascal Nouet, Claude Pellet, Francis Pressecq, Peter Schneider, Stewart Smith
Place of Publication	Piscataway, NJ
Publisher	IEEE
Number of pages	6
ISBN (Print)	9781538629529
DOIs	https://doi.org/10.1109/DTIP.2017.7984493
Publication status	Published - 20 Jul 2017
Event	19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 - Bordeaux, France Duration: 29 May 2017 → 1 Jun 2017

Conference

Conference	19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
Country/Territory	France
City	Bordeaux
Period	29/05/17 → 1/06/17

Keywords

biosensors
electrochemistry
packaging

Access to Document

10.1109/DTIP.2017.7984493

Buchoux-etal-DTIP-2017-A-low-cost-patternable-packaging-technology-for-biosensorsAccepted author manuscript, 7.31 MB

Cite this

Buchoux, A., Blair, E. O., Tsiamis, A., Marland, J. R. K., & Smith, S. (2017). A low cost patternable packaging technology for biosensors. In B. Charlot, Y. Mita, P. Nouet, C. Pellet, F. Pressecq, P. Schneider, & S. Smith (Eds.), 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 Article 7984493 IEEE. https://doi.org/10.1109/DTIP.2017.7984493

@inproceedings{51c27f2c84e94a3e96fbd947b1d1c218,

title = "A low cost patternable packaging technology for biosensors",

abstract = "This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.",

keywords = "biosensors, electrochemistry, packaging",

author = "Anthony Buchoux and Blair, {Ewen O.} and Andreas Tsiamis and Marland, {Jamie R.K.} and Stewart Smith",

year = "2017",

month = jul,

day = "20",

doi = "10.1109/DTIP.2017.7984493",

language = "English",

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editor = "Benoit Charlot and Yoshio Mita and Pascal Nouet and Claude Pellet and Francis Pressecq and Peter Schneider and Stewart Smith",

booktitle = "2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017",

publisher = "IEEE",

note = "19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 ; Conference date: 29-05-2017 Through 01-06-2017",

}

Buchoux, A, Blair, EO, Tsiamis, A, Marland, JRK & Smith, S 2017, A low cost patternable packaging technology for biosensors. in B Charlot, Y Mita, P Nouet, C Pellet, F Pressecq, P Schneider & S Smith (eds), 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017., 7984493, IEEE, Piscataway, NJ, 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 29/05/17. https://doi.org/10.1109/DTIP.2017.7984493

A low cost patternable packaging technology for biosensors. / Buchoux, Anthony; Blair, Ewen O.; Tsiamis, Andreas et al.
2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. ed. / Benoit Charlot; Yoshio Mita; Pascal Nouet; Claude Pellet; Francis Pressecq; Peter Schneider; Stewart Smith. Piscataway, NJ: IEEE, 2017. 7984493.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

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AU - Smith, Stewart

PY - 2017/7/20

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N2 - This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

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ER -

A low cost patternable packaging technology for biosensors

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