A 2D ultrasonic array design incorporating hexagonal-shaped elements for NDE applications

J. Dziewierz; S.N. Ramadas; A. Gachagan; R.L. O'Leary; G. Hayward

doi:10.1109/ULTSYM.2009.5441447

A 2D ultrasonic array design incorporating hexagonal-shaped elements for NDE applications

J. Dziewierz, S.N. Ramadas, A. Gachagan, R.L. O'Leary, G. Hayward

Electronic And Electrical Engineering

Research output: Contribution to conference › Paper

2 Citations (Scopus)

119 Downloads (Pure)

Abstract

Contemporary 2D Ultrasonic arrays suffer from low SNR and limited steering capabilities. Yet, there is a great desire in the industry to increase the operational frequency, in order to enhance their volumetric imaging resolution. State-of-the art arrays use an orthogonal matrix of rectangular elements as this is a natural step forward from the conventional 1D array structure. The objective of this work is to evaluate properties of triangular, rather than rectangular ceramic pillars in a 1-3 connectivity piezoelectric composite for application in a hexagonal-element 2D array. A 3MHz prototype device exploiting new hexagonal substructure have been manufactured. Measured mechanical cross-coupling level is -21.9dB between neighbouring hexagonal elements, providing validation of simulation result. Corroboration between measured and FE modelled device behaviour is demonstrated.

Original language	English
Pages	422-425
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2009.5441447
Publication status	Published - Jan 2010
Event	2009 IEEE Ultrasonics Symposium - Rome, Italy Duration: 20 Sep 2009 → 23 Sep 2009

Conference

Conference	2009 IEEE Ultrasonics Symposium
Country	Italy
City	Rome
Period	20/09/09 → 23/09/09

Keywords

acoustic arrays
apertures
ultrasonic array design
ceramics

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10.1109/ULTSYM.2009.5441447

IEEE Symposium 2009 DziewierzFinal published version, 459 KB

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Dziewierz, J., Ramadas, S. N., Gachagan, A., O'Leary, R. L., & Hayward, G. (2010). A 2D ultrasonic array design incorporating hexagonal-shaped elements for NDE applications. 422-425. Paper presented at 2009 IEEE Ultrasonics Symposium, Rome, Italy. https://doi.org/10.1109/ULTSYM.2009.5441447

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